Electronic Device Electrode Encapsulation Shadow Mask Elimination
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Solution Overview
Problem
Current electronic devices face challenges in miniaturization and integration due to performance degradation caused by the use of shadow masks during the formation of active layers and opposed electrodes, leading to contamination and reduced uniformity of patterns.
Innovation Solution
The electronic device employs a novel structure with a opposed electrode and encapsulation films having a common planar shape, formed without a shadow mask, where the opposed electrode covers the active layer and encapsulation films are etched simultaneously to prevent direct exposure to heat, light, and chemicals, and to enhance encapsulation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If shadow masks are used during the formation of active layers and opposed electrodes, then pattern formation is achieved, but contamination occurs and uniformity of patterns is reduced
Solution Approach 1:
The patent removes the shadow mask from the manufacturing process entirely. Instead of using a shadow mask to define patterns, the invention forms the opposed electrode and encapsulation film with a common planar shape through direct deposition and etching processes, eliminating the source of contamination and uniformity issues associated with shadow masks
Solution Approach 2:
The patent replaces the mechanical shadow mask system with a chemical etching process. Rather than physically blocking deposition with a mask, the invention deposits materials uniformly and then uses selective etching to create the desired patterns, substituting a mechanical approach with a chemical one that avoids contamination
2Ease of manufacture
If shadow masks are used during the formation of active layers and opposed electrodes, then electrode patterns are formed, but electrode material deposition on shadow masks occurs
Solution Approach 1:
The shadow mask is completely removed from the process, eliminating the problem of electrode material depositing on it. The patent forms patterns through selective etching of deposited layers rather than through shadow mask-based deposition
Solution Approach 2:
The patent discards the shadow mask approach entirely and adopts an alternative methodology where excess material is removed through etching rather than being blocked during deposition, eliminating waste on the mask surface
3Reliability
If encapsulation films are formed after opposed electrode, then encapsulation is achieved, but direct exposure to heat, light, and chemicals occurs
Solution Approach 1:
The patent forms the encapsulation film concurrently with the opposed electrode through simultaneous deposition and etching processes, rather than sequentially. This preliminary formation of the encapsulation structure protects the active layer from harmful exposures during subsequent processing steps
Solution Approach 2:
The encapsulation film acts as an intermediary protective layer that is formed early in the process. By establishing this protective barrier concurrently with electrode formation rather than afterward, the active layer is shielded from heat, light, and chemical exposure during later manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces contamination and improves performance by preventing electrode material deposition on shadow masks and maintaining uniformity, resulting in a more reliable and efficient electronic device.
Implementation Method 1
forming a thin film associated with a first encapsulation film on the conductive layer associated with the opposed electrode
Implementation Method 2
forming a thin film associated with a first encapsulation film on the conductive layer associated with the opposed electrode
Implementation Method 3
simultaneously or sequentially etching the thin film associated with the first encapsulation film and the conductive layer associated with the opposed electrode
Data Source
AI summary
An electronic device includes a plurality of pixel electrodes, an active layer on the plurality of pixel electrodes, an opposed electrode on the active layer and covering an entirety of an upper surface of the active layer, and a first encapsulation film on the opposed electrode wherein the opposed electrode and the first encapsulation film have a common planar shapes.