Embedded Electrode-fPCB Sleeve Assembly for Catheter Manufacturing

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Solution Overview

Problem

The manual process of connecting multiple electrodes on cardiac catheters is labor-intensive, time-consuming, and difficult to regulate for quality control due to their small scale.

Innovation Solution

An automated manufacturing method and apparatus that electrically connects ring-shaped electrodes to a flexible printed circuit board (fPCB) and integrates the electrode-fPCB assembly on a sleeve, using injection molding to form a plastic sleeve over the assembly, while maintaining the proximal end of the fPCB strip exposed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual soldering is used to connect electrodes to wires, then electrical connections can be established, but the process becomes labor-intensive and time-consuming

Engineering Contradiction:
Improveelectrical connection qualityVSAvoidmanufacturing speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces manual mechanical soldering operations with an automated reflow soldering system. The fPCB assembly is placed on a programmable reflow soldering apparatus that automatically heats and solders multiple electrodes simultaneously, eliminating the need for manual soldering while maintaining connection quality and significantly increasing production speed.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent divides the catheter assembly into modular segments: the fPCB strip is prepared separately with electrodes attached, then this pre-assembled unit is integrated onto the catheter shaft. This segmentation allows parallel processing of different components and simplifies the overall assembly process, improving both quality control and manufacturing efficiency.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If multiple electrodes are disposed in a small space on the catheter, then precision and accuracy are improved, but alignment and connection become more difficult

Engineering Contradiction:
Improveelectrode positioning accuracyVSAvoidalignment complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The flexible printed circuit board (fPCB) serves multiple functions simultaneously: it provides structural support for mounting multiple electrodes, establishes electrical connections between electrodes and the catheter system, and enables precise positioning of electrodes in a compact arrangement. This multi-functional design simplifies the overall system while achieving high precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses a standardized fPCB design with repeating patterns of electrodes and connection points that can be replicated along the catheter shaft. This copying approach ensures consistent positioning and spacing of multiple electrodes, maintaining precision while reducing the complexity of individual alignment operations through standardization.

Inventive Principle:
Principle #26Copying

3Reliability

If ring-shaped electrodes are manually soldered to individual wires, then electrical connections are established, but labor costs increase and quality control becomes difficult

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmanufacturing simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges multiple individual wire connections into a single integrated fPCB assembly. Instead of soldering separate wires to each electrode, all electrode connections are made through the fPCB's circuit traces and connection points, which are then collectively integrated onto the catheter shaft. This merging reduces the number of discrete operations while maintaining connection reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces manual soldering operations with automated reflow soldering technology. The programmable heating system automatically applies precise thermal profiles to solder all electrodes to the fPCB simultaneously, eliminating the need for skilled manual soldering while ensuring consistent, high-quality connections and simplifying the manufacturing process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates efficient, high-quality electrical connections between electrodes and wires, reducing labor costs and improving precision and accuracy in catheter manufacturing.

Implementation Method 1

The heat source is configured to apply heat for soldering the pad to an inner surface of the electrode

Methodology Applied
Scientific EffectSoldering: Soldering

Implementation Method 2

The injection molding device is configured to mold the plastic sleeve over the electrode-fPCB assembly

Methodology Applied
Scientific EffectInjection molding:

Data Source

PatentEP4701354A1Plastic sleeve with embedded electrode and flexible PCB
Publication Date: 2026.02.25 BIOSENSE WEBSTER (ISRAEL) LTD
  • EP4701354A1 patent drawingFigure 1~2
  • EP4701354A1 patent drawingFigure 3A~3C
  • EP4701354A1 patent drawingFigure 4A~4B

AI summary

An apparatus for manufacturing catheter electrode-fPCB assemblies, the apparatus includes a tray, a heat source, and a sleeve molding station. The tray is configured to (i) receive an electrode in a designated first recess in a predefined layout of the recess, wherein the electrode is ring-shaped and (ii) receive a flexible printed circuit board (fPCB) strip in a second recess configured to enable to thread the fPCB strip via the electrode to a predefined position of the strip such that a pad patterned on the fPCB strip is aligned with the electrode. The heat source is configured to apply heat for soldering the pad to an inner surface of the electrode. The sleeve molding station is configured to mold an encapsulating sleeve over the electrode-fPCB assembly, while keeping a proximal end of the strip and at least a portion of the electrode exposed.