Multilayer Electronic Component Electrodes for Solder Alignment Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic components face challenges with mounting stability due to misalignment defects as they shrink during soldering, especially at smaller sizes, affecting their secure attachment to printed circuit boards.
Innovation Solution
The design includes external electrodes with outer portions having a greater size in the second direction than central portions, enhancing contact area with solder and improving mounting stability by increasing the contact area between the component and the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the multilayer electronic component is designed with smaller size, then the component achieves high integration and reduced device footprint, but mounting stability deteriorates due to misalignment during soldering
Solution Approach 1:
The external electrode is designed with non-uniform dimensions where the first dimension (in the second direction) is greater than the second dimension (in the third direction). This local dimensional variation creates an enlarged mounting surface in the critical direction, improving solder joint reliability without increasing the overall component volume.
Solution Approach 2:
The patent changes the dimensional parameters of the external electrode by defining specific relationships between its first and second dimensions. By setting the first dimension to be greater than the second dimension, the electrode geometry is optimized to provide better mounting stability while maintaining compact component size.
2Ease of manufacture
If the external electrode has uniform dimensions, then the manufacturing process is simplified, but mounting alignment precision deteriorates due to insufficient contact area with solder
Solution Approach 1:
The external electrode employs non-uniform dimensions with the first dimension exceeding the second dimension. This local dimensional differentiation enhances the contact area with solder in the critical mounting direction, improving alignment precision while maintaining manufacturing simplicity through a straightforward geometric design.
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, fifth and sixth surfaces opposing each other in a third direction; and external electrodes including central portions disposed on centers of the third and fourth surfaces and outer portions disposed on outer regions of the third and fourth surfaces. The external electrode includes a lower electrode layer disposed in the central and outer portions, and an upper electrode layer disposed in the outer portion and disposed on the lower electrode layer. When a maximum size in the second direction of the central portion is defined as Le1, a maximum size in the second direction of the outer portion is defined as Le2, Le2>Le1 is satisfied.