Array Substrate Electrode Grooves for Orientation Film Uniformity
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Solution Overview
Problem
Poor coating of the orientation film on array substrates for liquid crystal display panels leads to reduced yield and degraded picture quality, particularly when an organic insulating layer is used between the electrode and drive circuit layers.
Innovation Solution
The method involves forming a groove structure on the electrode layer that extends to the connection via-hole of the insulating material layer, guiding the orientation liquid to diffuse evenly into the via-hole, thereby preventing accumulation and improving coating uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an organic insulating layer is used between the electrode and drive circuit layers, then the insulation performance is improved, but the orientation film coating quality deteriorates due to poor coating
Solution Approach 1:
The electrode layer is segmented into multiple parts (first electrode layer and second electrode layer) separated by an insulating dielectric layer. This segmentation allows the formation of groove structures that guide orientation liquid flow, resolving the coating quality issue while maintaining insulation through the dielectric layer between electrode segments
Solution Approach 2:
An insulating dielectric layer is introduced as an intermediary between the first and second electrode layers. This intermediary layer provides the necessary insulation performance while allowing groove structures to be formed in it for guiding orientation liquid, thus resolving the conflict between insulation and coating quality
2Ease of manufacture
If the electrode layer is formed without groove structures, then the manufacturing process is simpler, but the orientation liquid distribution becomes uneven causing mura defects
Solution Approach 1:
Groove structures are preliminarily formed in the electrode layer or insulating dielectric layer before orientation film deposition. These pre-formed grooves guide the orientation liquid flow during the coating process, ensuring uniform distribution and preventing mura defects while adding minimal manufacturing complexity
3Quantity of substance
If the orientation liquid accumulates in the connection via-hole region, then the via-hole filling is improved, but the overall coating uniformity deteriorates
Solution Approach 1:
The electrode layer structure is made non-uniform with localized groove structures that direct orientation liquid flow. The grooves concentrate liquid flow into specific regions (via-holes) while maintaining overall uniformity by preventing accumulation in other areas, thus achieving both via-hole filling and coating uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The groove structure enhances the uniform distribution of the orientation liquid, improving the yield of array substrates and the picture quality of the display panel by reducing mura defects.
Implementation Method 1
guiding the orientation liquid to diffuse evenly into the via-hole
Data Source
AI summary
The present disclosure provides an array substrate and a method of manufacturing the same and a display panel, which belongs to the field of display technologies. The method of manufacturing the array substrate comprises: providing a base substrate; forming a drive circuit layer on the base substrate, wherein the drive circuit layer includes a switching transistor; forming an insulating material layer on one side of the drive circuit layer distal to the base substrate, wherein the insulating material layer has a connection via-hole exposing at least a part region of a drain electrode of the switching transistor; and forming an electrode layer on one side of the insulating material layer distal to the base substrate, wherein a surface of the electrode layer distal to the base substrate has groove structures extending to the connection via-hole.