Electrode Substrate Laser Cutting With Integrated Edge Cleaning

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Solution Overview

Problem

Existing methods for cutting electrode substrates in battery production face challenges in effectively removing material buildup during the cutting process, which can lead to defects such as burrs and material protrusions, compromising the integrity and functionality of the battery cells.

Innovation Solution

A beam cutting method that incorporates a cleaning jet to remove material ejection by material ablation, either before or during the cutting process, creating a depression for the cutting operation to minimize protrusions, and using a laser system for both cutting and cleaning to optimize the cutting strategy and reduce material buildup.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a cutting jet is used to cut the electrode substrate by material ablation, then cutting speed and precision are improved, but material ejection and buildup occur on the surface

Engineering Contradiction:

Improvecutting precisionVSAvoidmaterial ejection

Core Design Contradiction:

Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful material ejection into a beneficial effect by using the same laser beam that causes ablation to also remove the ejected material through controlled scanning. The laser beam's energy that would otherwise create harmful deposits is instead used to vaporize and remove these materials, transforming the harmful byproduct into part of the cleaning mechanism

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces a gas flow as an intermediary medium between the laser beam and the electrode substrate surface. This gas flow carries away the ablated material particles and prevents them from depositing on the surface, acting as a mediator that facilitates material removal while protecting the workpiece

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If multiple cleaning passes are performed to remove material buildup, then surface quality is improved, but processing time increases

Engineering Contradiction:

Improvesurface qualityVSAvoidprocessing time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent implements continuous cleaning action by integrating the cleaning function into the cutting process itself. The laser beam continuously scans the surface during and after cutting, maintaining a clean surface throughout the operation rather than requiring separate discrete cleaning steps, thus eliminating idle time between cutting and cleaning operations

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The patent performs preliminary cleaning by scanning the surface with the laser beam before final inspection or subsequent processing steps. This preliminary removal of material buildup prevents defects from forming later in the manufacturing process, reducing the need for rework and additional cleaning passes

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces material buildup on the electrode substrate surface, ensuring smooth surfaces for battery assembly, minimizing defects and enhancing production efficiency by integrating cleaning into the cutting process without additional equipment.

Implementation Method 1

Cutting the electrode substrate by guiding a cutting beam along a cutting line to completely or partially cut through the electrode substrate by material ablation

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

Cleaning the electrode substrate by traversing a cutting edge area extending along at least one of the cutting edges with a cleaning beam designed and adjusted to remove material ejection occurring during cutting by material ablation

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentEP4663336A1Methods and devices for cutting and cleaning an electrode substrate

Publication Date: 2025.12.17 GROB WERKE & K G

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AI summary

To improve the mass production of electrodes with regard to effort, quality, reliability and speed, the invention proposes a beam cutting method for cutting an electrode substrate (12), comprising the step of: a) cutting the electrode substrate (12) by guiding a cutting beam (14) along a cutting line (18) to completely or partially cut through the electrode substrate (12) by material ablation and thus produce a first and second cutting edge (52, 54), wherein the beam cutting method further comprises at least one of the steps of: b) cleaning the electrode substrate (12) by traversing a cutting edge area (56) extending along at least one of the cutting edges (52, 54) by means of a cleaning beam (26) which is designed and adjusted to remove material ejection (28) occurring during cutting by material ablation.and/or c) pre-cleaning the electrode substrate (12) prior to step a) by traversing a pre-cleaning area (58) extending along the cutting line (18) using the cleaning jet (26), which is designed and adjusted to remove material by material ablation in order to create a depression (60) along the cutting line (18) in which the cutting is carried out in step a).