Electronic Component Electrode Layout for Pre-Singulation Inspection
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Solution Overview
Problem
The existing manufacturing methods for electronic components, such as elastic wave devices, face challenges in individually inspecting electrodes on a mother substrate due to the connection of all terminal electrodes by feed lines, making it difficult to detect defects before the singulation process.
Innovation Solution
A manufacturing method that includes an electrode forming process to create functional electrode portions and pad portions on a substrate, followed by an inspection process using a probe before plating, and a singulation process to form electronic components, allowing for intermediate inspection and ensuring accurate detection of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If all terminal electrodes are connected by feed lines on the mother substrate, then the manufacturing process is simplified, but individual inspection of electrodes becomes difficult
Solution Approach 1:
The patent divides the mother substrate into multiple regions, each containing a plurality of element electrodes. By segmenting the substrate and organizing electrodes in groups, the patent enables regional inspection while maintaining the overall manufacturing efficiency. This segmentation allows inspection probes to access specific electrode regions without requiring complete disconnection of feed lines across the entire substrate.
2Measurement precision
If inspection is performed after singulation, then individual electrode inspection is possible, but defective products cannot be detected earlier in the manufacturing process
Solution Approach 1:
The patent performs inspection of element electrodes on the mother substrate before the singulation process. By conducting preliminary inspection while electrodes are still connected to feed lines on the mother substrate, defective products can be identified and removed earlier in the manufacturing process, reducing waste and improving efficiency without compromising inspection accuracy.
3Reliability
If feed lines connect all terminal electrodes, then electrical connectivity is ensured, but intermediate inspection during manufacturing is prevented
Solution Approach 1:
The patent applies different structural characteristics to different regions of the mother substrate. Specific regions are designed with feed lines that allow probe access for inspection, while maintaining overall electrical connectivity. This local differentiation enables intermediate inspection at strategic points without compromising the electrical connectivity function of the feed lines across the entire substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables intermediate inspection during the manufacturing process, reducing defective product supply and improving the non-defect ratio of electronic components by allowing for the evaluation of functional electrode characteristics before final assembly.
Implementation Method 1
The plating process is a process of performing electrolytic plating while supplying power to the feed lines, to form a plating film that electrically connects the feed lines and the pad portions.
Data Source
AI summary
A manufacturing method of an electronic component allows an intermediate inspection during a manufacturing process and includes forming element electrodes and feed lines such that pad portions of the element electrodes and the corresponding one of the feed lines faces each other via a gap in a plan view, and such that the feed lines are located below the pad portions 11b. Electrolytic plating is performed while power is supplied to the feed lines to form a plating film that electrically connects the feed lines and the pad portions. The mother substrate is singulated to obtain an electronic component.