Electrode Layout for Thermal Expansion in Large-Substrate Processing
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Solution Overview
Problem
The existing substrate processing apparatuses face issues with short circuits between electrodes due to differences in coefficients of thermal expansion, leading to inefficient substrate processing and uniformity problems.
Innovation Solution
The substrate processing apparatus is designed with a first electrode having protruding electrodes and a second electrode with insertion holes, where the positions of the protruding electrodes and insertion holes are adjusted to prevent short circuits by aligning the centers of the protruding electrodes with the centers of the insertion holes, even after thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the centers of the protruding electrodes are aligned with the centers of the insertion holes, then process gases can be uniformly injected, but thermal expansion causes misalignment and short circuits
Solution Approach 1:
The patent applies preliminary anti-action by pre-positioning the protruding electrodes at locations that are intentionally offset from the centers of the insertion holes. This offset positioning is calculated in advance to compensate for the expected thermal expansion that will occur during substrate processing. As a result, when thermal expansion happens, the electrodes naturally move into proper alignment with the insertion holes, preventing short circuits while maintaining uniform gas injection.
2Productivity
If the temperature in the chamber is increased for substrate processing, then processing efficiency is improved, but thermal expansion causes electrode misalignment
Solution Approach 1:
The patent applies parameter changes by modifying the initial positional parameters of the protruding electrodes before processing. Specifically, the electrodes are positioned at predetermined offset locations that account for thermal expansion parameters. When the chamber temperature increases during processing, the electrodes expand and move to their correct operational positions, maintaining alignment precision despite the temperature change and enabling efficient substrate processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents short circuits and maintains the uniformity of thin films during substrate processing, even for large substrates, by ensuring proper alignment of electrodes despite thermal expansion.
Implementation Method 1
During substrate processing processes carried out in the substrate processing apparatus, the temperature in the chamber is increased, and the first and second electrodes are thermally expanded due to an increase in temperature
Data Source
AI summary
Provided is a substrate processing apparatus. The positions of a first electrode and a second electrode are adjusted in advance in consideration of differences in coefficients of thermal expansion so that a short circuit created by contact between the first electrode and the second electrode is prevented even in the case in which the first electrode and the second electrode are thermally expanded during processing. Even in the case in which the first electrode and the second electrode are thermally expanded due to an increase in temperature during processing, a short circuit between the first electrode and the second electrode can be prevented, and the uniformity of a thin film can be maintained in the substrate processing apparatus for processing a large substrate.