Electrode Structure Using Metal Foil and Adhesive Layer
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Solution Overview
Problem
As electronic components become smaller, conventional electrode structures face challenges in maintaining electrical performance and mechanical strength, particularly due to size constraints and issues with electroplating, which can lead to reliability problems and short circuits.
Innovation Solution
A novel electrode structure comprising a metal foil with an adhesive material and a metal layer, where the metal foil covers part of the terminal element, and the metal layer electrically connects to the exposed portion, enhancing mechanical strength and reliability while preventing material spread into unwanted areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electroplating is used on Ag glue layer, then electrical connection is achieved, but the Ag glue layer is susceptible to temperature and moisture changes, degrading electrical performance and mechanical strength
Solution Approach 1:
The patent uses a composite electrode structure consisting of multiple metal layers (e.g., Ni, Pd, Au) deposited over the Ag glue layer. This composite structure protects the Ag glue layer from direct exposure to harsh environments while maintaining electrical conductivity, thus improving reliability without compromising the stability of the underlying Ag glue layer.
Solution Approach 2:
The patent introduces intermediate metal layers (such as Ni and Pd) between the Ag glue layer and the external environment. These intermediary layers act as barriers that prevent direct interaction between the Ag glue layer and harmful factors like moisture and oxygen, thereby protecting the Ag glue layer from degradation while maintaining electrical connection.
2Ease of manufacture
If chemical plating is used, then electrode formation is achieved, but material can spread into unwanted areas causing short circuits
Solution Approach 1:
The patent applies a protective coating or mask pattern on the substrate before the plating process. This preliminary action defines the exact areas where plating material should deposit, preventing material spread into unwanted areas while still allowing easy electrode formation through controlled plating processes.
Solution Approach 2:
The patent implements selective plating where different areas of the substrate receive different treatments. By controlling the plating process to deposit material only in specific locations (using masks or patterned surfaces), the patent achieves ease of manufacture while preventing harmful material spread that could cause short circuits.
3Reliability
If lead frame is used for electrode, then electrical connection is achieved, but the lead frame takes large space, not suitable for small footprint components
Solution Approach 1:
The patent extracts and eliminates the lead frame component from the electrode structure. Instead of using a separate lead frame, the patent directly forms electrodes on the substrate surface through plating and coating processes, thereby achieving reliable electrical connection while significantly reducing the space occupied by the electrode structure.
Solution Approach 2:
The patent merges the electrode function directly into the substrate surface by forming conductive layers and patterns directly on the substrate. This integration eliminates the need for separate lead frames, achieving reliable electrical connection while minimizing the overall footprint of the component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves electrical performance and mechanical strength, ensuring reliable connections without the need for lead frames, allowing for smaller and more reliable electronic components.
Implementation Method 1
a metal foil having an adhesive material on the bottom surface thereof, the metal foil being adhered on the body through the adhesive material
Implementation Method 2
a metal layer, overlaying on the metal foil and covering the second portion of the terminal part of the conductive element, wherein the metal layer is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit
Data Source
AI summary
An electrical component is disclosed, wherein the electrical component comprises: a body; a conductive element disposed in the body; a first metal layer, disposed on the body and electrically connected to a terminal of the conductive element; a conductive and adhesive layer, overlaying on the first metal layer; and a second metal layer, overlaying on the first metal layer and the conductive and adhesive layer, wherein a first conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer and the conductive and adhesive layer, and a second conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer without passing through the conductive and adhesive layer.