Semiconductor Electrode Connection Structure for Thermal Stress Relief
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Solution Overview
Problem
Conventional semiconductor devices face reliability issues due to thermal stress caused by differences in thermal expansion coefficients between the strap member and the semiconductor element, leading to potential damage and reduced reliability.
Innovation Solution
The semiconductor device incorporates a first conductive member with a non-bonding portion that overlaps with the finger electrode portion, reducing the bonded area and alleviating thermal stress, and features a sealing resin that covers the conductive members and the semiconductor element, while the conductive members are directly bonded to the electrodes, reducing internal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the strap member is bonded to cover almost the entire surface of the electrode, then electrical connection is improved, but thermal stress increases due to difference in thermal expansion coefficients
Solution Approach 1:
The conductive member is divided into a bonding portion (first portion) and a non-bonding portion (second portion). The bonding portion is bonded to the electrode surface to ensure electrical connection, while the non-bonding portion extends beyond the electrode surface to provide thermal expansion buffer space, reducing thermal stress on the semiconductor element.
2Reliability
If the conductive member is directly bonded to the electrode, then internal resistance is reduced, but thermal stress concentration occurs at the bonding region
Solution Approach 1:
Different portions of the conductive member have different functions: the first portion (bonding portion) is designed for electrical connection with the electrode, while the second portion (non-bonding portion) is designed to extend beyond the electrode surface to accommodate thermal expansion. This local differentiation allows the bonding region to maintain low contact resistance while the extended region provides thermal stress relief.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the semiconductor device by preventing damage from thermal stress and reducing internal resistance, while allowing for flexible design and improved heat dissipation.
Implementation Method 1
the thermal expansion coefficients of the strap member and the semiconductor element are not necessarily equal. Therefore, thermal stress caused by a difference in the thermal expansion coefficients is generated
Implementation Method 2
the first conductive member is electrically connected to the first electrode; a second conductive member electrically connected to the second electrode
Data Source
AI summary
There is provided a semiconductor device, including: a semiconductor element which includes an element main surface and an element rear surface that face opposite sides in a thickness direction and in which a first electrode and a second electrode are formed on the element main surface; a first conductive member electrically connected to the first electrode; a second conductive member electrically connected to the second electrode; and a sealing resin configured to cover part of the first conductive member, part of the second conductive member, and the semiconductor element.