Electrode Pad Assembly Groove Drainage for Copper Planarity

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor processing technologies face challenges in uniformly distributing process solutions during electrochemical mechanical processes, leading to non-uniform deposition or removal of conductive materials on wafer substrates, which affects the efficiency and consistency of copper metallization in semiconductor devices.

Innovation Solution

An apparatus and method utilizing a distribution plate with grooves to efficiently distribute and drain process solutions onto a conductive surface, ensuring uniform solution flow and minimizing waste, by using a pad to polish the surface while maintaining a controlled flow and drainage system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional electrochemical deposition or electrochemical mechanical deposition is used to form copper layers, then copper metallization can be achieved, but non-uniform deposition occurs leading to poor planarity

Engineering Contradiction:

Improveplanarity of copper layerVSAvoiddeposition uniformity

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The distribution plate is segmented into multiple grooves that divide and distribute process solution across different regions of the conductive surface. This segmentation ensures uniform solution distribution and prevents non-uniform deposition, directly resolving the contradiction between manufacturing precision and reliability by addressing the root cause of non-planarity through structured solution flow control.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If process solution is supplied to the conductive surface during electropolishing, then material removal can be achieved, but non-uniform flow distribution leads to inconsistent polishing results

Engineering Contradiction:

Improveuniformity of material removalVSAvoidsolution distribution control

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The distribution plate incorporates grooves with varying characteristics (openings at different positions, including end openings) to optimize local solution distribution. This local quality approach ensures that process solution is uniformly distributed across the entire conductive surface area, enabling consistent polishing results while simplifying operation through automated uniform flow control.

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If a pad is used to sweep the conductive surface during ECMD or ECMP, then planarization can be achieved, but excessive process solution waste occurs

Engineering Contradiction:

Improvesurface planarityVSAvoidprocess solution waste

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

The distribution plate design includes end openings that allow used process solution to be efficiently drained and removed from the system. This discarding mechanism prevents solution accumulation and waste while maintaining continuous supply of fresh solution to the conductive surface, enabling effective planarization with optimized solution usage and reduced waste.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the uniformity of copper layer deposition and removal, reduces the need for planarization, and optimizes the use of process solutions, improving the efficiency and stability of semiconductor processing by ensuring consistent material distribution and efficient cleaning processes.

Implementation Method 1

at least one groove formed in the first surface to distribute the process solution thereon

Methodology Applied

Scientific EffectFluid flow distribution:

Implementation Method 2

an apparatus for use in electropolishing a conductive surface of a wafer utilizing a process solution

Methodology Applied

Scientific EffectElectropolishing:

Implementation Method 3

ECMP processes employ a polishing pad to polish the copper surface while an anodic potential is applied thereon

Methodology Applied

Scientific EffectElectrochemical dissolution: Electrolysis

Implementation Method 4

the at least one groove includes an end opening configured to drain fluid from the at least one groove

Methodology Applied

Scientific EffectFluid drainage:

Data Source

PatentUS7550070B2Electrode and pad assembly for processing conductive layers

Publication Date: 2009.06.23 NOVELLUS SYSTEMS INC

AI summary

An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for draining of process solution, both during processing and subsequent cleaning/rinsing of the pad. Drainage occurs continually during processing, cleaning and rinsing, and so is constricted through the end openings relative to the grooves, to prevent wastage. The end openings are sufficiently large, however, to substantially completely drain fluids from the grooves between steps without delaying robotic motions.