Outer Electrode Formation Using Continuous Paste Film Spreading

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Solution Overview

Problem

Existing methods for forming outer electrodes on chip-type electronic components require multiple applications of electrode paste, increasing tact time and leading to application failures due to solvent volatilization and inefficient paste usage, as well as complex operating mechanisms.

Innovation Solution

A method and apparatus that involve a flat board with a squeegee blade for spreading and applying electrode paste to multiple electronic components simultaneously, reducing the need for intermediate paste collection and maintaining consistent paste film size to prevent solvent volatilization, while simplifying the operating mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If electrode paste is applied multiple times to ensure sufficient coverage, then manufacturing precision is improved, but loss of time increases due to repeated collection and spreading operations

Engineering Contradiction:

Improveelectrode paste coverageVSAvoidtact time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The flat board is divided into multiple sections corresponding to different holding plate positions, allowing simultaneous preparation of paste films for multiple application cycles. Each section can be independently managed while maintaining overall process efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Paste films are prepared in advance on the flat board before the actual electrode application. By pre-spreading the paste on the flat board and maintaining it ready, the system eliminates waiting time during the application process, allowing multiple dip operations to proceed without intermediate collection steps.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If the flat board is extended to accommodate multiple holding plates for reduced collection frequency, then productivity is improved, but device complexity increases

Engineering Contradiction:

Improveelectrode application efficiencyVSAvoidflat board size

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The flat board serves multiple functions: it acts as both the substrate for paste film preparation and the support structure for multiple holding plate positions. This multi-functional design allows the same component to address both paste application and positioning requirements, reducing the need for additional specialized components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Loss of substance

If paste film is spread thinly to reduce paste consumption, then loss of substance is improved, but reliability deteriorates due to accelerated solvent volatilization

Engineering Contradiction:

Improvepaste consumptionVSAvoidapplication quality

Core Design Contradiction:

Loss of substanceVSReliability

Solution Approach 1:

The electrode paste application process is made continuous through the extended flat board configuration. Multiple holding plates can be dipped in sequence without interrupting the paste film preparation, maintaining constant paste properties and preventing solvent volatilization that would occur with repeated start-stop cycles.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The system rapidly processes through multiple application cycles by having pre-prepared paste films ready on the flat board. This rushed-through approach minimizes the time paste films are exposed to air, preventing solvent volatilization and maintaining paste quality throughout multiple applications.

Inventive Principle:

Principle #21Skipping (Rushing through)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces tact time by eliminating intermediate collection steps and prevents application failures by maintaining consistent paste properties, thereby improving efficiency and reducing paste consumption.

Implementation Method 1

a squeegee blade vertically slidable so as to adjust a gap from the flat board... spreading a paste film having a predetermined thickness on the flat board by moving relatively the squeegee blade with respect to the flat board

Methodology Applied

Scientific EffectMechanical pressure: Pressure Increase

Implementation Method 2

First end surfaces of electronic components held by a holding plate are dipped in the paste film spread on the flat board such that the electrode paste adheres to the first end surfaces of the electronic components

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS7895969B2Method and apparatus for forming outer electrode of electronic component

Publication Date: 2011.03.01 MURATA MFG CO LTD

AI summary

A method for forming an outer electrode capable of reducing a tact time when electrode paste is applied to end surfaces of electronic components a plurality of times. A paste tank 4 having a squeegee blade that is vertically slidable is disposed on a flat board 1 having an area being a plurality of times as large as that of a holding plate in a longitudinal direction of the flat board. A paste film is spread on the flat board by moving the flat board 1 by a length corresponding to the length of one holding plate while a predetermined gap is maintained between the squeegee blade and the flat board. The electrode paste is applied to first end surfaces of electronic components C held by the holding plate H by dipping the first end surfaces of the electronic components C in this paste film. The electrode paste is applied to the first end surfaces of the electronic components a plurality of times by repeating the spreading step and the applying step.