Electrode Plate Cooling Spaces in Semiconductor Devices
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Solution Overview
Problem
High-voltage and large-current power converters using semiconductor devices face inefficiencies in cooling, leading to increased size, part count, and costs due to the need for external cooling apparatus between stacked devices.
Innovation Solution
Incorporating cooling spaces within the electrode plates of semiconductor devices, allowing for internal circulation of a cooling medium, which reduces the necessity for additional cooling apparatus and enhances cooling efficiency, while also simplifying assembly and reducing electrical and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external cooling apparatus are disposed between stacked semiconductor devices, then cooling function is provided, but device complexity and part count increase
Solution Approach 1:
The cooling apparatus is merged with the semiconductor device structure itself. The case that houses the semiconductor element also serves as the cooling apparatus, with the bottom surface of the case forming a cooling surface that contacts the heat-radiating surface of the semiconductor element. This integration eliminates the need for separate external cooling components between stacked devices.
Solution Approach 2:
The case performs multiple functions: it provides mechanical housing for the semiconductor element, structural support, and thermal management through its bottom surface acting as a heat dissipation interface. This multi-functionality reduces the need for additional dedicated cooling parts.
2Temperature
If external cooling apparatus are disposed between stacked semiconductor devices, then cooling function is provided, but manufacturing costs increase
Solution Approach 1:
By combining the housing function and cooling function into a single case structure, the number of components to be manufactured, assembled, and managed is reduced, leading to lower manufacturing costs.
Solution Approach 2:
The cooling function is extracted from being a separate component and integrated into the case structure, eliminating the need to manufacture and assemble additional cooling parts between devices.
3Power
If multiple semiconductor devices are stacked for high voltage and large current, then power conversion capability is improved, but cooling efficiency deteriorates due to increased size and part count
Solution Approach 1:
Each semiconductor device is designed as an independent module with its own integrated cooling capability through the case structure. This segmentation allows each unit to be self-sufficient thermally, and when stacked, the cooling functions remain effective without requiring additional inter-device cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves cooling efficiency, reduces the size and part count of power converters, lowers manufacturing costs, and increases tolerance for uneven conductive grease application, resulting in a more efficient and cost-effective power conversion system.
Implementation Method 1
At least one of the first electrode plate and the second electrode plate has a space where a cooling medium circulates
Data Source
AI summary
A semiconductor device includes a first electrode plate, a second electrode plate disposed to oppose the first electrode plate, and a semiconductor chip disposed between the first electrode plate and the second electrode plate. At least one of the first electrode plate and the second electrode plate has a space where a cooling medium circulates.