Electrode Plate Gas Hole Drilling for Deep-Hole Circularity
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Solution Overview
Problem
The machining load during deep gas hole drilling in electrode plates for plasma processing apparatuses can lead to drill swinging, increased circularity of gas holes, and a decline in plasma processing quality.
Innovation Solution
A method involving a prepared hole forming step using a first drill to create a hole with a diameter of 50% to 80% of the final gas hole diameter, followed by a straight portion forming step using a second drill to extend the hole coaxially with the prepared hole, reducing the machining load and enhancing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If a single drill is used to machine deep gas holes exceeding 12 mm in depth, then the electrode plate thickness can be increased for life extension, but the machining load causes drill swinging and increased circularity (deteriorated quality)
Solution Approach 1:
The gas hole machining process is segmented into two distinct steps: first forming a prepared hole with a first drill, then forming the final straight portion with a second drill. This segmentation divides the heavy machining load of deep hole drilling into manageable portions, preventing drill swinging and maintaining circularity precision while enabling deep hole formation for extended electrode plate life.
Solution Approach 2:
A prepared hole is formed in advance with a first drill before the final gas hole is completed. This preliminary action creates a pre-formed cavity that reduces the machining load for the subsequent second drill, enabling accurate formation of deep gas holes exceeding 12 mm in depth without drill swinging or circularity deterioration.
2Ease of manufacture
If the electrode plate is made thinner, then the manufacturing cost is reduced, but the gas hole consumption accelerates and the electrode plate life decreases
Solution Approach 1:
The two-stage drilling process enables cost-effective manufacturing of thick electrode plates by improving machining efficiency and reducing drill wear. The prepared hole reduces the load on the second drill, allowing accurate deep hole formation in thicker plates without prohibitively increasing manufacturing complexity, thus extending electrode plate life while maintaining manufacturing feasibility.
3Manufacturing precision
If a prepared hole with diameter less than 50% of the straight portion diameter is used, then the machining load on the second drill is reduced, but the effect of load reduction is insufficient and the first drill may break due to increased load
Solution Approach 1:
The diameter of the prepared hole is optimized to be 50-80% of the final gas hole diameter. This parameter range balances the machining load between the first and second drills: the prepared hole is large enough to provide significant load reduction for the second drill (improving circularity) but not so large that it overloads the first drill (protecting drill durability).
Data Source
AI summary
Provided is a method of manufacturing an electrode plate for a plasma processing apparatus for forming a plurality of gas holes having a straight portion exceeding 12 mm in length in a thickness direction of an electrode plate main body in a penetrating state and in parallel to each other, the method including: a prepared hole forming step of forming a prepared hole with a diameter of 50% or more and 80% or less of a diameter of a hole forming the straight portion with a first drill from one surface of the electrode plate main body; and a straight portion forming step of forming the straight portion to overlap the prepared hole with a second drill.