Electrode Plate Laser Cutting to Prevent Sputter and Layer Peeling
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Solution Overview
Problem
The manufacturing method of electrode plates in secondary batteries results in the easy detachment of electrode active substance layers and fine metal pieces (sputters) due to reduced adhesive properties and laser-induced contamination, leading to potential internal short circuits.
Innovation Solution
A manufacturing method using pulse lasers for both active substance and substrate exposed areas, with adjusted frequencies and lap rates to minimize contamination and scatter, forming thick parts with anchor shapes to enhance adhesion and prevent detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a laser is used to cut the electrode precursor, then the electrode plate can be cut out from the electrode precursor, but the electrode substrate melts and mixes with the electrode active substance layer, reducing adhesive property and causing broken pieces to fall off
Solution Approach 1:
The cutting process is divided into two distinct stages: first cutting the active substance provided area, then cutting the substrate exposed area. This segmentation allows different laser parameters to be applied to different regions, preventing substrate melting during the first cut and avoiding sputter scattering during the second cut.
Solution Approach 2:
The active substance provided area is cut first before cutting the substrate exposed area. This preliminary action removes the electrode active substance layer in advance, so that when the substrate is subsequently cut, any sputter or scattered metal particles will not stick to the electrode active substance layer, preventing adhesive property reduction.
2Ease of manufacture
If the outer circumferential edge part of the substrate exposed area is cut to form electrode tab, then the connecting position can be secured, but fine metal pieces (sputter) are scattered and stick to the electrode plate, causing fall off and peel off
Solution Approach 1:
The active substance provided area is cut first before cutting the substrate exposed area. This preliminary action removes the electrode active substance layer in advance, so that when the substrate is subsequently cut, any sputter or scattered metal particles will not stick to the electrode active substance layer, preventing adhesive property reduction.
3Device complexity
If conventional laser cutting is used for both areas, then the cutting process is simple, but both broken pieces of electrode active substance layer and sputter fall off or peel off
Solution Approach 1:
Different laser parameters are applied to different cutting areas: for the active substance provided area, laser parameters are optimized to prevent substrate melting; for the substrate exposed area, laser parameters are optimized to minimize sputter scattering. This local quality approach ensures each cutting stage addresses its specific problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method inhibits the detachment of electrode active substance layers and sputters, improving the safety and efficiency of secondary battery production by reducing the risk of internal short circuits.
Implementation Method 1
by irradiating a pulse laser on the electrode substrate, the active substance provided area is cut
Implementation Method 2
by irradiating a pulse laser on the electrode substrate, the active substance provided area is cut
Implementation Method 3
by irradiating a pulse laser on the substrate exposed area, a part of the substrate exposed area is cut out
Implementation Method 4
fine metal piece (sputter) easily falls off or is peeled off
Data Source
AI summary
According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active substance provided area A1 in which an electrode active substance layer 24 is provided on a surface of the electrode substrate 22 and including a substrate exposed area A2 in which the electrode active substance layer 24 is not provided and the electrode substrate 22 is exposed, an active substance provided area cutting step for cutting the active substance provided area A1 by a pulse laser, and a substrate exposed area cutting step for cutting the substrate exposed area A2 by the pulse laser. Then, the frequency of the pulse laser in the substrate exposed area cutting step is made to be larger than the frequency of the pulse laser in the active substance provided area cutting step, and the lap rate of the pulse laser in the substrate exposed area cutting step is made to be equal to or more than 90%. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.