Semiconductor Electrode Plate Support for Parallel Die Bonding
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Solution Overview
Problem
Existing semiconductor devices fail to effectively suppress the inclination of electrode plates over semiconductor elements, leading to potential issues with heat radiation and current density, as well as stress distribution and insulation performance.
Innovation Solution
A semiconductor device design that incorporates an insulating substrate, semiconductor elements, an electrode plate, support wires, and a second joining material, where the support wires maintain the electrode plate parallel to the semiconductor element, preventing inclination and ensuring consistent heat radiation and current distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the electrode plate is directly joined onto the semiconductor element without support wires, then the device structure is simpler, but the electrode plate becomes inclined which affects heat radiation and current density uniformity
Solution Approach 1:
Support wires are introduced as intermediary elements between the electrode plate and semiconductor element. These wires prevent direct contact while maintaining proper spacing and alignment, thereby preventing electrode plate inclination without requiring complex joining structures. The support wires act as mediators that simplify the overall joining process while achieving precise positional control.
2Manufacturing precision
If support wires are added to prevent electrode plate inclination, then the positioning precision is improved, but the number of components and manufacturing steps increases
Solution Approach 1:
The support wires are installed beforehand before joining the electrode plate to the semiconductor element. This preliminary positioning action ensures that the electrode plate will be correctly aligned during the subsequent joining process, preventing inclination issues without requiring complex real-time adjustment mechanisms during manufacturing.
3Temperature
If the electrode plate is allowed to incline on the semiconductor element, then the device structure is simpler, but the heat radiation and current density uniformity deteriorates
Solution Approach 1:
Rather than requiring the entire electrode plate structure to be complex, the support wires are strategically positioned at specific locations where they provide maximum stabilizing effect. This localized support approach prevents electrode plate inclination and ensures uniform heat radiation and current density distribution without unnecessarily complicating the overall device structure.
Data Source
AI summary
A semiconductor device includes an insulating substrate, a semiconductor element joined onto the insulating substrate with a first joining material interposed therebetween, a plurality of support wires that are provided between the semiconductor element and an electrode plate provided above the semiconductor element in contact with the semiconductor element and the electrode plate, and a second joining material that is provided on the semiconductor element and joins the semiconductor element and the electrode plate.