Multilayer Electronic Component Electrode Plating for Hydrogen Blocking

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Solution Overview

Problem

The formation of hydrogen during the plating process on the external electrode of multilayer electronic components leads to reduced moisture resistance reliability due to potential penetration into the body, causing defects and deterioration of electrical properties.

Innovation Solution

A multilayer electronic component design that includes a Cu electrode layer with a Ni layer and an intermetallic compound layer comprising Ni and Sn, which are sequentially formed to prevent direct contact and diffusion issues, thereby blocking hydrogen and moisture penetration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a plating layer is formed on the external electrode, then electrical conductivity and sealing properties are improved, but hydrogen is generated during the plating process which penetrates into the body causing moisture resistance deterioration

Engineering Contradiction:

Improvemoisture resistance reliabilityVSAvoidhydrogen generation during plating

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

An intermetallic compound layer comprising Ni and Sn is introduced as an intermediary layer between the Cu electrode layer and the Ni plating layer. This intermediate layer prevents direct contact between Cu and Ni, thereby suppressing hydrogen generation during the plating process while maintaining electrical conductivity and sealing properties.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The external electrode structure uses a composite plating layer system consisting of multiple materials (Cu electrode layer, Ni-Sn intermetallic compound layer, and Ni plating layer) stacked in sequence. This composite structure combines the advantages of each material to achieve both conductivity and hydrogen suppression.

Inventive Principle:

Principle #40Composite materials

2Reliability

If a plating layer is formed on the external electrode, then sealing and mounting properties are improved, but interfacial void defects occur between the plating layer and electrode layer

Engineering Contradiction:

Improvesealing and mounting propertiesVSAvoidinterfacial void defects

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The Ni-Sn intermetallic compound layer serves as a mediator between the Cu electrode layer and Ni plating layer, ensuring good interfacial bonding. This intermediate layer prevents direct Cu-Ni contact that would cause void formation, thereby eliminating interfacial void defects while maintaining sealing and mounting properties.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If the plating layer structure is simplified, then manufacturing complexity is reduced, but moisture and hydrogen penetration into the body cannot be effectively prevented

Engineering Contradiction:

Improveplating layer structure complexityVSAvoidmoisture and hydrogen penetration

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

A composite plating layer structure comprising Cu electrode layer, Ni-Sn intermetallic compound layer, and Ni plating layer is adopted. This multi-layer composite structure effectively prevents moisture and hydrogen penetration into the body while maintaining reasonable manufacturing complexity through a systematic design.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly enhances moisture resistance reliability by preventing interfacial void defects and improving sealing and mounting properties, ensuring improved electrical performance.

Implementation Method 1

an intermetallic compound layer disposed on the Ni layer and comprising an intermetallic compound including at least one of Ni and Sn

Methodology Applied

Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentUS12586729B2Multilayer electronic component

Publication Date: 2026.03.24 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.