Electrode Protective Layer for Uniform Plasma Edge Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in minimizing damage to components due to plasma reactions, reducing component lifespan, and achieving uniform process performance during plasma processing.
Innovation Solution
A substrate processing apparatus is designed with a protective layer on the electrodes, composed of materials like Nd, Pm, Sm, Gd, Y, Sc, Er, and O, which provides enhanced plasma resistance, and an optical sensor to adjust the gap between the substrate and the protective layer based on the radius of curvature, ensuring uniform processing and extending the protective layer's lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are exposed to plasma during substrate processing, then plasma processing can be performed, but component damage occurs due to plasma reactions
Solution Approach 1:
A protective layer is introduced as an intermediary between the plasma and the electrode components. This protective layer has high plasma resistance and serves as a barrier that prevents direct interaction between the reactive plasma and the underlying electrode materials, thereby protecting the components while allowing plasma processing to proceed
Solution Approach 2:
The protective layer is formed using composite materials with specific compositions (including rare earth elements such as Nd, Pm, Sm, Gd, Y, Sc, Er along with F and O) that exhibit superior plasma resistance. This composite material structure provides enhanced protection compared to single-material coatings
2Duration of action of stationary object
If protective layers are applied on electrode surfaces, then component lifespan is extended, but device complexity increases
Solution Approach 1:
The protective layer is applied in advance to the electrode surfaces before they are subjected to plasma processing. This preliminary protective coating is deposited on the electrode surfaces as part of the component preparation, extending their operational life without requiring complex real-time protection mechanisms during processing
3Manufacturing precision
If uniform plasma processing is achieved, then process performance is improved, but gap control precision must be increased
Solution Approach 1:
The system employs dynamic gap adjustment between the upper and lower electrodes during plasma processing. By making the electrode spacing adjustable and controllable, the system can optimize plasma distribution and processing uniformity across the substrate surface, compensating for variations without requiring extremely tight fixed gap tolerances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces component damage, increases the lifespan of protective layers, and maintains uniform process performance by using high plasma-resistant materials and dynamic gap adjustments, thereby enhancing the overall efficiency and reliability of the substrate processing apparatus.
Implementation Method 1
a protective layer arranged on a surface of at least a portion of the lower electrode unit and the upper electrode unit and including a material having greater plasma resistance than each of the lower electrode unit and the upper electrode unit
Implementation Method 2
an optical sensor to adjust the gap between the substrate and the protective layer based on the radius of curvature
Data Source
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AI summary
A substrate processing apparatus includes a housing defining a processing space, a lower electrode unit supporting the substrate, an upper electrode unit spaced apart from the lower electrode unit with the substrate therebetween, a gas supply unit configured to supply a process gas for plasma processing an edge region of the substrate, and a protective layer arranged on a surface of at least a portion of the lower electrode unit and the upper electrode unit and including a material having great plasma resistance.