Internal Electrode Roughness and Thickness Control in Ceramic Components

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Solution Overview

Problem

Existing electronic components face challenges in reducing DC resistance while preventing excessive reduction in AC resistance, which can lead to signal attenuation and impedance issues due to the thickness and roughness of internal electrodes.

Innovation Solution

The electronic component features ceramic internal electrodes with specific thickness and roughness ratios, where the first internal electrode has a thickness of 0.9 μm or less and a lower roughness than the second internal electrode, connected through external electrodes on a ceramic main body, with the second internal electrode's roughness being no more than half its thickness to maintain AC resistance and prevent parallel resonance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If uniform roughness is applied to all internal electrodes, then manufacturing is simplified, but DC resistance cannot be sufficiently reduced without excessively reducing AC resistance

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidDC resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent implements different roughness specifications for different internal electrodes: the first internal electrode uses a smoother surface (roughness ≤0.5 μm) while the second uses a rougher surface (roughness ≥0.6 μm). This local quality differentiation optimizes both DC and AC resistance characteristics, overcoming the limitation of uniform roughness application while remaining manufacturable through controlled paste formulation and printing parameters.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS9287044B2Electronic component and fabrication method thereof
Publication Date: 2016.03.15 SAMSUNG ELECTRO MECHANICS CO LTD
  • US9287044B2 patent drawing
  • US9287044B2 patent drawing
  • US9287044B2 patent drawing

AI summary

There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t1 and t2 of the first and second internal electrodes is 0.9 μm or less, while a roughness R1 of the first internal electrode is lower than a roughness R2 of the second internal electrode.