Electronic Component External Electrode Space Design
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Solution Overview
Problem
The conductive resin layer in electronic components tends to peel off from the sintered metal layer due to moisture absorption and subsequent gasification, leading to stress and potential cracking during solder-mounting.
Innovation Solution
Incorporating a space within the conductive resin layer or between the resin layer and the sintered metal layer, where the maximum length in the thickness direction is shorter than in the orthogonal direction, and an intermediate plating layer with better solder leach resistance, to mitigate stress and prevent peel-off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the conductive resin layer is made dense without spaces, then the structural integrity is improved, but moisture absorption leads to gasification stress and peel-off during solder-mounting
Solution Approach 1:
The patent introduces a space (void) within the conductive resin layer or between the conductive resin layer and sintered metal layer. This space acts as a cushioning chamber that absorbs expansion stress when moisture in the resin gasifies during solder-mounting, preventing peel-off while maintaining structural integrity.
Solution Approach 2:
The space is designed in advance to accommodate the volume expansion that occurs when moisture in the conductive resin layer gasifies during solder-mounting. By providing this pre-configured cushioning space, the patent prevents stress buildup that would otherwise cause peel-off between layers.
2Reliability
If a large space is created in the conductive resin layer to reduce stress, then resistance to peel-off is improved, but the strength of the external electrode deteriorates
Solution Approach 1:
The space is localized within specific regions of the conductive resin layer rather than being uniformly distributed. This localized approach provides stress relief where needed while maintaining the overall structural integrity and strength of the external electrode in critical areas.
Solution Approach 2:
The patent optimizes the size, shape, and distribution parameters of the space within the conductive resin layer. By carefully controlling these parameters, the design achieves the right balance between providing sufficient cushioning volume to prevent peel-off and maintaining adequate structural strength for the external electrode.
3Reliability
If the first maximum length of the space in thickness direction is increased to reduce gas pressure, then stress on conductive resin layer is reduced, but crack occurrence increases due to external force
Solution Approach 1:
The patent designs the space with asymmetric dimensions where the first maximum length in the thickness direction is controlled to be shorter than the second maximum length in the orthogonal direction. This asymmetric configuration optimizes the balance between gas pressure reduction and crack resistance by providing sufficient volume for pressure relief while maintaining structural continuity in the thickness direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces stress on the conductive resin layer, preventing peel-off and cracking, while also enhancing solder leach resistance and maintaining the strength of the external electrode.
Implementation Method 1
the moisture absorbed by the resin may be gasified so that volume expansion may occur
Implementation Method 2
The resin tends to absorb moisture
Data Source
AI summary
An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.