Electronic Component Electrode Structure to Prevent Resin Layer Peeling
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Solution Overview
Problem
The conductive resin layer in electronic components tends to peel off from the element body due to external stress, leading to reduced mounting strength and potential moisture infiltration, which deteriorates electrical characteristics, especially when used on ferrite materials where the anchor effect is not exhibited.
Innovation Solution
Incorporating a resin film with high adhesive strength between the conductive resin layer and the element body, and using an amorphous glass layer between the conductive resin layer and the ferrite material surface to prevent peeling, while ensuring the conductive resin layer is in contact with the resin film to enhance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the conductive resin layer is disposed to cover the sintered metal layer, then the external electrode structure is formed, but the conductive resin layer peels off from the element body under external stress
Solution Approach 1:
The patent introduces a resin layer as an intermediary between the conductive resin layer and the ferrite material surface. This resin layer has high adhesive strength to both the conductive resin layer and the ferrite material, acting as a mediator that prevents peeling. The resin layer is applied directly on the ferrite material surface, and the conductive resin layer is then formed on the resin layer, creating a stable layered structure that resolves the adhesion problem.
2Device complexity
If the conductive resin layer is in direct contact with the ferrite material surface, then the structure is simplified, but the anchor effect is not exhibited and peeling occurs
Solution Approach 1:
The resin layer serves as a mediator between the conductive resin layer and the ferrite material surface. Although this adds a layer to the structure, it significantly improves adhesive strength by providing a surface that the conductive resin layer can firmly bond to, compensating for the lack of anchor effect on the ferrite material surface.
Solution Approach 2:
The patent uses a composite structure consisting of the resin layer and conductive resin layer. The resin layer provides adhesion to the ferrite material, while the conductive resin layer provides electrical conductivity. This composite material approach allows each layer to perform its specific function, resolving the contradiction between structural simplicity and adhesive strength.
3Reliability
If the conductive resin layer is peeled off, then mounting strength decreases, but moisture infiltration deteriorates electrical characteristics
Solution Approach 1:
The resin layer is applied beforehand on the ferrite material surface to prevent peeling of the conductive resin layer. By providing this protective layer in advance, the patent prevents both the loss of mounting strength and the subsequent moisture infiltration that would occur if the conductive resin layer peeled off, thus cushioning against multiple harmful effects simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses peeling of the conductive resin layer, maintaining the mounting strength and electrical integrity of the electronic component, even under external stress, and prevents moisture infiltration, thereby ensuring reliable performance.
Implementation Method 1
the resin film does not contain a conductive material and has high adhesive strength with the element body
Implementation Method 2
using an amorphous glass layer between the conductive resin layer and the ferrite material surface to prevent peeling
Data Source
AI summary
An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.