External Electrode Thickness Layout for Moisture-Resistant MLCCs

Solution Overview

Problem

Multilayer ceramic electronic components face challenges in miniaturization with deteriorated corner coverage performance and moisture resistance due to thin external electrodes formed by conventional dipping methods, which allow foreign materials like moisture to permeate, affecting product quality.

Innovation Solution

A multilayer ceramic electronic component design with a ceramic body featuring a capacitance formation portion, internal electrodes, and external electrodes where the ratio of conductive layer thickness at the end to central portion exceeds 0.07, enhancing corner coverage and moisture resistance by using conductive layers to cover base electrodes and prevent moisture permeation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the external electrode is formed by the dipping method, then the manufacturing process is simple, but the corner coverage performance deteriorates and moisture resistance decreases

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidmoisture resistance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies different paste compositions to different regions of the external electrode. The end portion uses paste containing glass powder with particle sizes of 0.5 μm to 5 μm for improved corner coverage, while the central portion uses conventional paste. This local differentiation resolves the contradiction by optimizing each region's properties independently.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite paste materials combining different glass powder particle sizes (0.5 μm to 5 μm and 5 μm to 10 μm) in specific proportions (30-70 wt% and 30-70 wt%). This composite approach improves both corner coverage and moisture resistance while maintaining manufacturing simplicity through the dipping method.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If the external electrode is formed by the dipping method, then the manufacturing process is simple, but the corner coverage performance deteriorates

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidcorner coverage performance

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies different paste compositions to different regions of the external electrode. The end portion uses paste containing glass powder with particle sizes of 0.5 μm to 5 μm for improved corner coverage, while the central portion uses conventional paste. This local differentiation resolves the contradiction by optimizing each region's properties independently.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the particle size distribution parameter of glass powder in the paste composition. By using finer glass powder (0.5 μm to 5 μm) at the end portion, the paste fills corners more effectively during dipping, improving corner coverage performance while maintaining the simplicity of the dipping process.

Inventive Principle:

Principle #35Parameter changes

3Volume of moving object

If the external electrode is made thinner for miniaturization, then the component size is reduced, but the moisture resistance deteriorates

Engineering Contradiction:

Improvecomponent sizeVSAvoidmoisture resistance

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent applies different paste compositions to different regions of the external electrode. The end portion uses paste containing glass powder with particle sizes of 0.5 μm to 5 μm for improved corner coverage, while the central portion uses conventional paste. This local differentiation resolves the contradiction by optimizing each region's properties independently.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite paste materials combining different glass powder particle sizes (0.5 μm to 5 μm and 5 μm to 10 μm) in specific proportions (30-70 wt% and 30-70 wt%). This composite approach improves both corner coverage and moisture resistance while maintaining manufacturing simplicity through the dipping method.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12198863B2Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrode

Publication Date: 2025.01.14 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is ‘a’, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is ‘b’, ‘b/a’ is 0.07 or more.