Electrode Window Layout for Stable Light-Cured Component Bonding

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Solution Overview

Problem

The existing method of curing a bonding member using laser light is ineffective for regions covered with opaque electrodes, as the laser light is blocked, leading to unstable curing.

Innovation Solution

A manufacturing method for an electronic component that includes a first and second structure with electrodes on their surfaces, where at least one electrode has a window portion to allow light to pass through, enabling the bonding member to be cured by irradiating it with light through these window portions while applying pressure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser light is used to cure the bonding member, then curing efficiency is improved and excessive heat is avoided, but the region covered with opaque electrode cannot be cured stably

Engineering Contradiction:
Improvecuring efficiencyVSAvoidcuring stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The electrode is divided into a light-transmissive region and a light-blocking region. The light-transmissive region (window portion) allows curing light to pass through to cure the bonding member underneath, while the light-blocking region prevents excessive light exposure. This segmentation resolves the contradiction by enabling stable curing across the entire bonding member surface while maintaining the protective function of the electrode.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the electrode are assigned different optical properties: the window portion has light-transmissive characteristics to enable curing, while other portions maintain light-blocking characteristics. This local differentiation allows the bonding member to be cured reliably even in regions that would normally be blocked by opaque electrodes.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If the bonding member is cured by direct laser irradiation, then the region not covered with electrode is easily cured, but the region covered with opaque electrode is not easily cured

Engineering Contradiction:
Improvecuring easeVSAvoidcuring uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The electrode structure is segmented to include a window portion that allows light transmission. This segmentation enables uniform curing across the entire bonding member by providing light access paths to previously blocked regions, while maintaining the ease of laser-based curing process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The window portion acts as an intermediary structure that mediates between the laser light source and the bonding member. It allows light to reach the bonding member in regions that would otherwise be blocked by the electrode, achieving uniform curing without changing the fundamental laser curing process.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for stable curing of the bonding member over the entire region, including areas covered with opaque electrodes, by ensuring that the curing light can reach all necessary areas, thereby improving the bonding process.

Implementation Method 1

the bonding member is cured by irradiating the bonding member with light through the window portion

Methodology Applied
Scientific EffectLight curing: Photopolymerisation

Implementation Method 2

applying a force to the first structure and the second structure so as to pressurize the bonding member

Methodology Applied
Scientific EffectPressure application: Compression

Data Source

PatentUS12292657B2Electronic component, manufacturing method thereof, and electronic apparatus
Publication Date: 2025.05.06 CANON KK
  • US12292657B2 patent drawing
  • US12292657B2 patent drawing
  • US12292657B2 patent drawing

AI summary

A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.