Electrode Wiring Structure with Pre-arranged Layer for Defect-Free Electroplating
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Solution Overview
Problem
The electroplating process for forming electrode wiring on a substrate often results in non-uniformity and preferential reaction of copper ions near retaining walls, leading to holes within the wiring structure, which affects electrical conductivity and the overall integrity of the electrode wiring.
Innovation Solution
A wiring structure is developed that includes a pre-arranged layer on the substrate, which guides the growth direction of the electrode wiring during electroplating, ensuring copper ions are reduced to copper atoms in a controlled region, thereby forming a dense and defect-free electrode wiring without internal holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electroplating process is used to form electrode wiring, then deposition rate is high and cost is low, but copper ions exhibit non-uniform deposition and preferential reaction near retaining walls leading to holes in wiring structure
Solution Approach 1:
The patent applies preliminary action by forming a pre-arranged layer on the substrate before electroplating. This layer is positioned at the wiring position and serves as a foundation that guides subsequent copper ion deposition. The pre-arranged layer is formed in advance to prevent non-uniform deposition issues that would otherwise occur during the electroplating process, thereby maintaining both high deposition rate and uniformity.
Solution Approach 2:
The pre-arranged layer acts as an intermediary between the substrate and the electrode wiring. It mediates the electroplating process by providing a controlled surface that guides copper ion deposition, preventing preferential reaction near retaining walls and ensuring uniform wiring formation while maintaining the efficiency of the electroplating process.
2Ease of manufacture
If conventional electroplating is used, then process is simple and cost-effective, but holes form within the wiring structure affecting electrical conductivity
Solution Approach 1:
The pre-arranged layer is formed in advance at the wiring position on the substrate. This preliminary structure guides the electroplating process to deposit copper uniformly, preventing hole formation that would compromise electrical conductivity. The additional step maintains process simplicity while significantly improving wiring reliability.
3Device complexity
If electroplating is performed without pre-arranged layer, then manufacturing process is simpler, but copper ions react preferentially near retaining walls causing non-uniform wiring
Solution Approach 1:
By forming the pre-arranged layer in advance, the patent establishes a controlled foundation that directs copper ion deposition. This simple additional structure prevents the complex non-uniform reaction patterns that occur near retaining walls, achieving uniform electrode wiring with minimal increase in process complexity.
Solution Approach 2:
The pre-arranged layer serves as an intermediary that mediates between the substrate and the electroplating process. It creates a uniform deposition surface that eliminates preferential reactions near retaining walls, ensuring consistent wiring uniformity without significantly complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved electrical conductivity and prevents defects within the electrode wiring, ensuring reliable performance by eliminating holes and enhancing the structural integrity of the wiring.
Implementation Method 1
The copper electroplating is based on Faraday's laws of electrolysis. During electrolysis, the mass of a substance precipitated or dissolved on the electrode is proportional to the amount of electricity passing through the electrode.
Implementation Method 2
The signal line on a substrate may be prepared by an electroplating process. The electroplating process has the advantages of high deposition rate, lower cost, lower deposition temperature (room temperature).
Implementation Method 3
On the contrary, on a cathode wafer, the copper ions gain the electrons and become the copper atoms.
Data Source
AI summary
The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.