Electrodeless LED Display Transparent Conduction Layer
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Solution Overview
Problem
Conventional LED displays face issues with large lamination spacing and reduced light intensity due to electrode placement, requiring backlight modules for increased volume and efficiency, which limits resolution and brightness.
Innovation Solution
An electrodeless LED display is fabricated using a lithography process to define a light-emitting region without electrodes, featuring a transparent conduction layer, etched conduction channels, and metal members to connect dies in series, eliminating the need for a pick and place process and backlight modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are placed on the LED display to provide current distribution, then electrical connection is improved, but the package area is increased and light intensity is reduced
Solution Approach 1:
The patent removes traditional metal electrodes from the LED display structure and replaces them with transparent conduction layers. This extraction of the harmful element (metal electrodes that block light) while retaining the essential function (electrical conduction) through an alternative material (transparent conductor) resolves the contradiction between electrical connection reliability and light transmission efficiency
Solution Approach 2:
The patent changes the material parameter of the conduction layer from opaque metal to transparent material. This parameter change allows the conduction layer to simultaneously perform electrical conduction and light transmission functions, eliminating the trade-off between electrical connection and light intensity
2Area of stationary object
If flip-chip package is used to reduce package area, then wire bonding is eliminated, but light is absorbed by upper substrate and cannot penetrate to exterior
Solution Approach 1:
The patent changes the optical parameter of the conduction layer from opaque to transparent, enabling light to pass through the conduction layer and reach the exterior while maintaining the compact flip-chip package structure. This parameter change resolves the contradiction between small package area and high light intensity
3Device complexity
If large lamination spacing is used in flip-chip LED display, then package is simplified, but resolution is limited
Solution Approach 1:
The patent segments the conduction structure into transparent conduction layers and conduction channels that can be precisely patterned using lithography processes. This segmentation allows for small lamination spacing while maintaining simple package structure, resolving the contradiction between package simplicity and high resolution
4Illumination intensity
If backlight modules are used to increase brightness, then illumination is improved, but volume and efficiency are reduced
Solution Approach 1:
The patent extracts and eliminates the backlight module from the LED display structure by implementing transparent conduction layers that allow direct light emission from the LED chips. This removal of the backlight module reduces device volume while maintaining high brightness through improved light transmission efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high resolution, high brightness, and a light-emitting surface that does not shield light, making the LED display more competitive for various applications without the drawbacks of conventional designs.
Implementation Method 1
a transparent conduction layer, and the transparent conduction layer is formed between the epitaxial layer and the substrate
Implementation Method 2
uses a lithography process to define a light-emitting region
Implementation Method 3
etching the epitaxial layer to form a plurality of dies spaced on the transparent conduction layer
Implementation Method 4
depositing a metal film on an upper surface of each die; respectively forming two conduction metal blocks at two ends of each conduction channel; forming a plurality of first metal members on the metal film formed on each die
Implementation Method 5
A lighting principle and a structure of a LED are different from those of a conventional light source. The LEDs feature low power dissipation, long life, and fast lighting response
Data Source
AI summary
An electrodeless LED display and a method for fabricating the same are disclosed. In the method, an epitaxial layer is provided and a transparent conduction layer is formed on the epitaxial layer to bond a substrate. The epitaxial layer is etched to form dies deposition metal films on the transparent conduction layer. Conduction channels are formed on the substrate, and two ends of each conduction channel are respectively provided two conduction metal blocks. First metal members are formed on the metal film formed on the dies and the conduction metal blocks to connect with the dies on the different conduction channels. Then, second metal members are formed on the first metal members formed on the conduction metal blocks, whereby the second metal members and the first metal members formed on the dies are located on an identical plane.