Electrodeposition Gap Characterization Fixture
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Solution Overview
Problem
Current methods for characterizing the plating gap in electrodeposition tools are invasive, labor-intensive, and costly, often requiring the tool to be taken offline and involving manual adjustments to ensure proper alignment and spacing.
Innovation Solution
A fixture and system are introduced to characterize the plating gap, featuring a substrate holder interface and a protrusion that contacts the anode structure, allowing for automated gap characterization without draining the plating cell, and enabling adjustments to be made without manual intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual methods are used to characterize plating gap, then measurement can be performed, but labor intensity increases and downtime increases
Solution Approach 1:
The system uses the electrodeposition tool's own operational parameters and existing structures (anode, substrate holder, lift mechanism) to perform self-characterization of the plating gap. The controller actuates the lift and detects hard touch conditions to automatically measure gap spacing without external manual intervention or tool removal.
Solution Approach 2:
The patent replaces manual mechanical measurement methods with an automated electromechanical system. The controller electronically controls the lift actuation and detects contact conditions through torque sensors or position detection, substituting manual physical measurement with automated sensor-based detection.
2Manufacturing precision
If manual adjustments are made for alignment, then proper spacing can be achieved, but labor costs increase
Solution Approach 1:
The system incorporates feedback mechanisms where the controller monitors lift position, torque levels, or other operational parameters to detect when the substrate holder contacts the anode structure. This feedback enables automatic detection of proper alignment and gap spacing without manual verification.
Solution Approach 2:
The electrodeposition tool performs its own alignment and gap characterization through automated actuation of the lift mechanism and detection of contact conditions, eliminating the need for external manual adjustment and verification operations.
3Measurement precision
If plating cell is drained for characterization, then accurate measurement can be obtained, but loss of time increases
Solution Approach 1:
The system performs gap characterization measurements during normal operational conditions or before actual plating runs, using preliminary actuation of the lift mechanism to detect hard touch conditions. This eliminates the need to drain the plating cell for measurements, as the characterization can be performed while the cell remains filled and operational.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for efficient, automated characterization of the plating gap, reducing downtime and labor costs, while ensuring accurate and consistent film deposition on substrates.
Implementation Method 1
detect a lift position at which the substrate holder meets a threshold rotational condition by actuating the lift to move the substrate holder toward the anode structure until a hard touch is detected between the anode structure and a gap characterization fixture held in the substrate holder
Implementation Method 2
a lift configured to change a spacing between the anode structure and the substrate holder
Implementation Method 3
apply a rotational torque to the substrate holder
Implementation Method 4
Electrodeposition involves the electrochemical reduction of dissolved ions of a selected metal to an elemental state on the substrate surface
Data Source
AI summary
Examples are disclosed herein that relate to characterizing a plating gap between an anode structure and a cathode in an electrodeposition tool. One example provides a fixture for characterizing a spacing of a plating gap of an electrodeposition tool. The fixture comprises a substrate holder interface configured to contact a seal of a substrate holder of the electrodeposition tool. The fixture further comprises a protrusion comprising a contact surface configured to contact the anode structure of the electrodeposition tool during a plating gap characterization process. A thickness dimension comprising a distance between a plane of the substrate holder interface and the contact surface of the protrusion corresponds to a preselected plating gap spacing.