Electrodynamic Nanoparticle Patterning via Mask Perforations
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Solution Overview
Problem
Existing methods for patterning 3-dimensional nanostructures face challenges such as material reuse limitations, surface ion charge control difficulties, high material loss due to mask contamination, and the inability to form 3-dimensional structures using photo-resistors or vacuum deposition with metal masks, especially at the nano-scale.
Innovation Solution
A process involving a mask with perforations is used in a grounded reactor to guide charged nanoparticles to a substrate, forming an electrodynamic focusing lens by applying voltage, allowing for precise 3-dimensional patterning without noise patterns, with optional ion layer accumulation and varying voltage applications to control deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photo-resistor is used for patterning charged particles, then 2-dimensional patterns can be formed, but the photo-resistor cannot be reused and multiple patterning steps are required to form 3-dimensional structures
Solution Approach 1:
The invention uses a mask as a reusable template that copies the desired pattern onto the substrate multiple times. The mask with perforations serves as a physical copy of the pattern that can be repeatedly used for deposition, eliminating the need for repeated photo-resistor patterning steps while maintaining high patterning accuracy.
Solution Approach 2:
The mask is prepared in advance with the desired pattern of perforations before the deposition process. This preliminary preparation allows the mask to be reused for multiple deposition cycles, significantly reducing the number of patterning steps required to form complex 3-dimensional structures compared to sequential photo-resistor methods.
2Manufacturing precision
If metal mask with perforations is used for vacuum deposition, then material loss due to mask contamination is very high when aspect ratio is high
Solution Approach 1:
The invention changes the deposition parameters by using a non-conductive mask material instead of metal, and controls the deposition process through electrical field management. This allows for lower deposition rates and better material utilization, reducing mask contamination and material loss while maintaining high aspect ratio pattern formation capability.
Solution Approach 2:
The non-conductive mask acts as an intermediary that allows charged particles to pass through perforations while being guided by electrical fields. This intermediary approach enables precise pattern formation without the material adhesion problems that plague metal masks, significantly reducing material loss during high aspect ratio deposition.
3Measurement precision
If electron beam photolithography is used, then nano-sized patterns can be produced, but the pattern size may be irregularly reduced due to material attached to mask surface
Solution Approach 1:
The invention uses a non-conductive mask that is less susceptible to material adhesion and contamination compared to metal masks. While the mask may eventually require replacement, its resistance to contamination maintains consistent pattern size throughout its service life, eliminating the irregular pattern size reduction problem associated with electron beam photolithography and metal masks.
Solution Approach 2:
The invention replaces the mechanical/physical mask system with an electrodynamic control system. Charged particles are guided through the mask perforations and focused onto the substrate using electrical fields, eliminating the mechanical contact and material adhesion issues that cause pattern size irregularities in traditional electron beam photolithography.
4Manufacturing precision
If prior art method is used for focused patterning, then charged particles can be guided through mask perforations, but only 2-dimensional patterns can be formed
Solution Approach 1:
The invention extends the patterning capability from 2-dimensional to 3-dimensional by controlling the deposition process in the vertical dimension. By using a non-conductive mask and electrodynamic focusing, particles can be deposited in controlled layers at different positions and angles, enabling the formation of 3-dimensional structures while maintaining high focusing accuracy.
Solution Approach 2:
The invention introduces dynamic control of the deposition process by adjusting electrical field parameters during deposition. This allows for real-time control of particle trajectories and deposition positions, enabling complex 3-dimensional structure formation while maintaining the high focusing accuracy achieved in the prior 2-dimensional method.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-accuracy, high-efficiency formation of 3-dimensional structures of various sizes and shapes, suitable for future nanoparticle-based devices like plasmon sensors and solar cells, by controlling charge and voltage levels.
Implementation Method 1
applying voltage to the substrate to form an electrodynamic focusing lens
Implementation Method 2
Charged particles (1) move along the electric field lines (10) by electrical force
Implementation Method 3
placing a mask having a pattern of perforations corresponding to a determined pattern at a certain distance above a substrate
Implementation Method 4
accumulating ion layer by introducing charged gas ions, which are charged with the same polarity as that of charged nanoparticles, onto the mask surface
Implementation Method 5
guiding the charged particles to the substrate through the pattern of perforations so that the particles can be selectively attached to the substrate
Data Source
AI summary
The present invention relates to a process for producing a 3-dimensional structure assembled from nanoparticles by using a mask having a pattern of perforations, which comprises the steps of: in a grounded reactor, placing a mask having a pattern of perforations corresponding to a determined pattern at a certain distance above a substrate to be patterned, and then applying voltage to the substrate to form an electrodynamic focusing lens; and introducing charged nanoparticles into the reactor, the charged particles being guided to the substrate through the pattern of perforations so as to be selectively attached to the substrate with 3-dimensional shape. According to the process of the present invention, a 3-dimensional structure of various shapes can be produced without producing noise pattern, with high accuracy and high efficiency.