Electroformed Contact Insulation for Narrow Pitch Probe Cards
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Solution Overview
Problem
Conventional methods for producing electroformed components, such as contacts, face challenges in arranging them at narrow pitches while maintaining electrical insulation and ensuring structural strength, particularly in probe cards for microcircuit boards, where the thinness of contacts and narrow pitches between holes complicates insertion and arrangement.
Innovation Solution
A method involving electrolytic degreasing of an electrically conductive base material, lamination of a dry film resist, exposure using a direct writing exposure device, development to form a mold, electroforming, and subsequent peeling of the mold, followed by application and patterning of an insulating film to facilitate precise positioning and insulation of the electroformed components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If contacts are arranged at narrow pitches to match narrow electrode pitches on microcircuit boards, then the probe card can inspect higher density circuits, but the thickness between adjacent through-holes and supporting holes becomes thin, compromising the structural strength of the probe card
Solution Approach 1:
The invention introduces an insulating film layer between adjacent contacts, adding a dimensional barrier that provides electrical insulation while maintaining narrow pitch arrangements. This allows the probe card to achieve high-density contact arrangements without compromising structural integrity, as the insulating film occupies the space between contacts rather than reducing the thickness of supporting structures
2Manufacturing precision
If the pitch between through-holes and supporting holes is reduced to enable narrow pitch contact arrangement, then higher density inspection is possible, but the insertion and arrangement of thin, extremely small contacts becomes extremely difficult
Solution Approach 1:
The insulating film is formed on the inner walls of through-holes and supporting holes before contact insertion. This preliminary insulating layer acts as a guide and protective coating, facilitating the insertion of thin, extremely small contacts into the narrow openings while preventing damage during the assembly process
Solution Approach 2:
The insulating film serves as an intermediary material between the through-holes/supporting holes and the contact elements. It provides a interface that eases the insertion process, protects the delicate contacts from damage, and maintains proper positioning during assembly
3Manufacturing precision
If contacts are arranged at narrow pitches, then higher density inspection capability is achieved, but electrical insulation between adjacent contacts becomes more difficult to maintain
Solution Approach 1:
The insulating film adds a dimensional barrier between adjacent contacts, providing electrical insulation in the lateral direction between contacts at narrow pitches. This allows high-density arrangements while maintaining reliable electrical insulation, as the insulating film creates a physical barrier that prevents electrical interference even when contacts are closely spaced
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the precise arrangement of electroformed components at narrow pitches with maintained electrical insulation, improving the structural integrity and ease of production by allowing for uniform and complex shape insulating films on the components, facilitating their stacking and use in dense microcircuit board inspection.
Implementation Method 1
a surface of an electrically conductive base material 21 is subjected to electrolytic degreasing
Implementation Method 2
a laser beam 13 is scanned, with the use of a direct writing exposure device, along a region of the surface of the photoresist 12
Implementation Method 3
in a case where a metal material is precipitated on an exposed surface of the electrically conductive base material 11 by electroforming
Data Source
Figure 1(A)~1(G)
Figure 2(A)~2(C)
Figure 3(A)~3(C)
AI summary
A contact element (25) (electroformed product) is produced by electroforming. The contact element (25) has a surface on which an insulating film (28) having been formed by use of a dry film resist (22) or the like is provided. In a process of producing the contact element (25), the insulating film (28) is provided after a step of producing the contact element 25. This makes it possible to provide electroformed components configured so that respective electroformed products (contact terminals (25)) are arranged at narrow pitches while maintaining electrical insulation of the electroformed products from each other.