Electroformed Binary Copper Alloy for High Strength Conductivity
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Solution Overview
Problem
Copper alloys face a trade-off between high strength and high conductivity, with traditional methods to enhance strength often compromising electrical conductivity, and certain alloy elements like Cd, Zn, and Sn being volatile, limiting their application in high-temperature and high-vacuum environments.
Innovation Solution
Electroformed binary copper alloys comprising copper and elements such as Cr, Fe, W, Mo, B, Co, or Ag, with a yield strength of at least 600 MPa and electrical conductivity of at least 20% IACS, achieved through an electroforming process that includes co-depositing Cu and alloying elements and heat treating to precipitate out intra-grain particulates, allowing for improved strength and conductivity without the volatility issues of traditional alloys.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional alloying methods (adding elements like Si, Al, Fe, Ni, Sn, Cd, Zn, Ag, Sb, Mg, Cr) are used to increase strength, then yield strength increases by two or three times, but electrical conductivity decreases dramatically
Solution Approach 1:
The patent changes the concentration parameters of alloying elements to extremely low levels (0.01-5 wt.% Cr, 0.01-2 wt.% Fe, 0.01-1 wt.% W, 0.01-0.5 wt.% Mo) compared to traditional alloys. This parameter change allows achieving high strength (≥600 MPa) while maintaining acceptable conductivity (≥20% IACS) by minimizing the harmful impact of alloying elements on electrical conductivity while still providing sufficient strengthening effect
Solution Approach 2:
The patent creates a composite copper alloy system combining multiple alloying elements (Cr, Fe, W, Mo) at optimized low concentrations. This composite approach allows synergistic strengthening effects from different elements while maintaining overall conductivity better than single-element alloys, achieving yield strength ≥600 MPa with conductivity ≥20% IACS
2Strength
If volatile alloy elements (Cd, Zn, Sn, Pb) are used to enhance strength, then mechanical properties improve, but application in high temperature and high vacuum environments is limited due to volatility
Solution Approach 1:
The patent extracts and eliminates volatile alloy elements (Cd, Zn, Sn, Pb) from the alloy composition entirely, replacing them with non-volatile elements (Cr, Fe, W, Mo) that have high melting points and low vapor pressures. This extraction resolves the contradiction by removing the harmful volatility property while retaining the strengthening function through the substitute elements
Solution Approach 2:
The patent replaces traditional volatile alloying elements with stable, non-volatile elements that provide comparable or superior strengthening without the drawback of volatility. Elements like Cr, Fe, W, and Mo form stable intermetallic compounds and solid solution strengthenings that maintain alloy integrity in high-temperature and vacuum environments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electroformed binary copper alloys achieve a balance of high strength and high conductivity, making them suitable for applications like electrical connectors, while reducing the need for additional mechanical reinforcement and allowing for smaller device designs with faster charging capabilities.
Implementation Method 1
depositing the Cu and X ions on a portion the cathode preform to form a binary Cu—X alloy
Implementation Method 2
heat treating the binary Cu—X alloy to precipitate particles of X and/or CuyXz to form an electroformed Cu—X article
Implementation Method 3
heat treating the binary Cu—X alloy to precipitate particles of X and/or CuyXz to form an electroformed Cu—X article
Data Source
AI summary
An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.