Double-Sided Electrode Semiconductor Package via Electroformed Support Removal
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Solution Overview
Problem
Conventional methods for manufacturing double-sided electrode semiconductor packages face challenges such as high cost, complex processes, and the need for through electrodes, which hinder the integration of multiple circuit elements like sensor ICs and processing LSI chips within a single package, especially in reducing package size and cost.
Innovation Solution
The method involves forming internal connection electrodes through electroforming on conductive supports, which are then connected to a wiring pattern on an organic or lead frame substrate, allowing for resin sealing and subsequent removal of the support to expose external connection electrodes, enabling flexible wiring and reducing the number of processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional through electrode methods are used, then double-sided electrode structure is achieved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The invention extracts and eliminates the through electrode structure from the package design. Instead of forming electrodes through the entire substrate thickness, the patent uses surface-mounted electrodes on the front face and corresponding pads on the back face, removing the complex through-hole drilling, plating, and insulation processes entirely.
Solution Approach 2:
The electrode connection is segmented into two separate surfaces rather than requiring a continuous through-electrode path. The front face electrodes and back face pads are electrically connected through the substrate plane, dividing the connection path into manageable segments that avoid the need for deep through-holes and complex insulation layers.
2Reliability
If through electrodes are formed with low-temperature treatment, then low resistance metal is achieved, but application to semiconductor process becomes difficult
Solution Approach 1:
The invention removes the through electrode formation process entirely from the semiconductor manufacturing workflow. By using surface electrodes connected through the substrate plane rather than through-holes, the process avoids low-temperature metal charging steps that are incompatible with standard semiconductor fabrication processes.
3Reliability
If high-temperature treatment is used for through hole insulation, then insulation is achieved, but application to packaging process becomes difficult
Solution Approach 1:
The invention extracts and eliminates the through-hole insulation process from the manufacturing sequence. By avoiding through-holes entirely and using surface electrodes with planar substrate connections, the need for high-temperature insulation treatments is removed, making the process compatible with standard packaging procedures.
4Volume of moving object
If multiple circuit elements are integrated in single package, then package size is reduced, but wiring complexity increases
Solution Approach 1:
The wiring architecture is segmented into independent front-face electrode connections and back-face pad connections, with electrical pathways routed through the substrate plane. This segmentation allows multiple circuit elements to be connected without requiring complex three-dimensional wire routing or through-electrode management, simplifying the overall wiring complexity while maintaining compact packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing of double-sided electrode packages at a lower cost without requiring through electrodes, allowing for compact electronic equipment mounting and flexible connection patterns, while integrating multiple elements like sensor ICs and processing LSI chips within a common package.
Implementation Method 1
Internal connection electrodes which are formed through electroforming and which are a feature of the present invention
Data Source
AI summary
A circuit element is disposed on an organic substrate and is connected to a wiring pattern provided on the organic substrate. Internal connection electrodes are formed on a support of a conductive material through electroforming such that the internal connection electrodes are integrally connected to the support. First ends of the internal connection electrodes integrally connected by the support are connected to the wiring pattern. After the circuit element is resin-sealed, the support is removed so as to separate the internal connection electrodes from one another. Second ends of the internal connection electrodes are used as external connection electrodes on the front face, and external connection electrodes on the back face are connected to the wiring pattern.