Integrated Electrokinetic Device Support with Thermal and Electrical Control
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Solution Overview
Problem
Existing systems for operating microfluidic devices, particularly electrokinetic microfluidic devices, lack comprehensive solutions for integrated control of electrical signals, temperature regulation, and fluid management, which are essential for precise manipulation and processing of micro-objects.
Innovation Solution
A system that includes a support configured to hold and operatively couple with an electrokinetic device, an electrical signal generation subsystem to apply a biasing voltage, a light modulating subsystem to emit structured light, and a thermal control subsystem to regulate the device's temperature, along with thermally-controlled flow controllers to manage fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate systems are used for electrical control, temperature regulation, and fluid management, then each subsystem can be optimized independently, but the overall system complexity increases and integration becomes difficult
Solution Approach 1:
The patent combines electrical signal generation, temperature regulation, and fluid management subsystems into a single integrated support structure. The support includes an electrical connection interface for voltage application, a thermal control interface with heating and cooling capabilities, and a fluid connection interface, all unified in one device that interfaces with the microfluidic chip through a single socket connection.
Solution Approach 2:
The support structure serves multiple functions simultaneously: it provides mechanical holding for the microfluidic chip, electrical connections for electrokinetic actuation, thermal regulation through Peltier elements and fluid cooling, and fluid pathway connections. This multi-functional design eliminates the need for separate systems for each function.
2Manufacturing precision
If comprehensive control subsystems are integrated into the support, then precise manipulation of micro-objects is enabled, but the support structure becomes more complex and costly
Solution Approach 1:
The patent integrates multiple control functions (electrical signaling, thermal regulation, fluid management) into a single support structure that interfaces with the microfluidic chip through one socket connection, thereby achieving precise manipulation capabilities without proportionally increasing overall system complexity.
Solution Approach 2:
The support structure provides uniform and stable environmental conditions across the microfluidic chip through integrated thermal control (heating and cooling) and electrical control, creating an equipotential operating environment that enhances manipulation precision while consolidating control mechanisms.
3Temperature
If thermal control is achieved through integrated Peltier devices and fluid cooling, then temperature regulation precision is improved, but the device requires more components and space
Solution Approach 1:
The patent combines Peltier thermoelectric devices for active heating and cooling with a fluid cooling system in an integrated thermal control assembly within the support structure. This merged approach achieves superior temperature regulation precision while consolidating thermal management components into a compact unit that interfaces through a single socket connection.
Solution Approach 2:
The support structure acts as an intermediary between the microfluidic chip and the external thermal control mechanisms. The integrated Peltier and fluid cooling systems within the support provide precise temperature regulation to the chip without requiring direct attachment of separate thermal control devices, thereby reducing overall device volume.
4Power
If electrical signal generation and waveform control are integrated into the support, then electrokinetic actuation is improved, but the electrical system becomes more complex
Solution Approach 1:
The patent integrates waveform generation and electrical signal control circuits directly into the support structure, combining power delivery and signal control functions in one location. This integration improves electrokinetic actuation performance while consolidating electrical components, thereby managing overall system complexity through unified design.
Solution Approach 2:
The integrated electrical system in the support includes waveform generation with feedback control to precisely regulate electrokinetic actuation. The feedback mechanism monitors and adjusts electrical signals delivered to the microfluidic chip, improving actuation precision while managing system complexity through intelligent control rather than additional hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables precise control over electrokinetic operations, allowing for selective manipulation of micro-objects, accurate temperature management, and controlled fluid handling, thereby enhancing the efficiency and precision of microfluidic processes.
Implementation Method 1
The thermal control subsystem may include a Peltier thermoelectric device and a cooling unit, wherein the Peltier thermoelectric device is configured to regulate a temperature of the electrokinetic device
Implementation Method 2
the cooling block includes the surface of the cooling unit, and the respective Peltier thermoelectric device and the thermoelectric power module may be mounted on and/or integrated with the support
Implementation Method 3
a liquid path configured to circulate cooled liquid between the liquid cooling device and the cooling block
Implementation Method 4
The electrical signal generation subsystem preferably includes a waveform generator configured to generate a biasing voltage waveform to be applied across the electrode pair
Implementation Method 5
an oscilloscope configured to measure the biasing voltage waveform, and wherein data from the measurement is provided as feedback to the waveform generator
Implementation Method 6
a light modulating subsystem configured to emit structured light onto the electrokinetic device when the electrokinetic device is held by, and operatively coupled with, the support
Data Source
Figure 1A
Figure 1B
Figure 2~4
AI summary
A system for operating an electrokinetic device includes a support configured to hold and operatively couple with the electrokinetic device, an integrated electrical signal generation subsystem configured to apply a biasing voltage across a pair of electrodes in the electrokinetic device, and a light modulating subsystem configured to emit structured light onto the electrokinetic device. The system can further include a thermally controlled flow controller, and/or be configured to measure impedance across the electrokinetic device. The system can be a light microscope, including an optical train. The system can further include a light pipe, which can be part of the light modulating system, and which can be configured to supply light of substantially uniform intensity to the light modulating system or directly to the optical train.