Electroless Pad Plating on Semiconductor Substrates Without Tape
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Solution Overview
Problem
Existing semiconductor device manufacturing processes face challenges in effectively protecting semiconductor packages from humidity and shock while ensuring reliable electrical connections with circuit boards, particularly in the electroless deposition of metal layers.
Innovation Solution
A method involving electroless deposition of metal layers on semiconductor substrates, followed by baking at controlled temperature ramps and atmospheres, to enhance adhesion and prevent oxidation, combined with precise singulation techniques to form semiconductor die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the substrate is inverted and placed on its edge during electroless plating, then the pad can be plated without tape, but the substrate requires complex handling and positioning equipment
Solution Approach 1:
The substrate is inverted and placed on its edge during electroless plating, allowing the pad to be positioned directly in the plating solution without requiring tape attachment. This inversion technique eliminates the need for complex tape handling equipment while enabling direct plating of the pad surface.
2Device complexity
If tape is attached to the substrate during plating, then the pad can be plated with conventional equipment, but the tape may become detached during substrate inversion and transport
Solution Approach 1:
The tape attachment step is completely removed from the process by inverting the substrate and placing it on its edge during plating. This extraction of the tape element eliminates the reliability issue of tape detachment while still enabling conventional plating equipment to be used.
3Ease of operation
If the substrate is processed in conventional orientation, then handling is simpler, but the pad cannot be effectively plated without tape attachment
Solution Approach 1:
The substrate is inverted and positioned on its edge during the plating process, which enables effective pad plating without tape attachment. After plating, the substrate is returned to its conventional orientation for subsequent handling and processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the adhesion and integrity of metal layers on semiconductor substrates, reducing oxidation and phase shifts, thereby enhancing the reliability of electrical connections and protecting against environmental factors.
Implementation Method 1
electroless depositing a metal layer on a pad included on the first largest planar surface
Implementation Method 2
after removing the tape, baking the semiconductor substrate
Data Source
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AI summary
Implementations of a method of electroless deposition may include providing a semiconductor substrate including a first largest planar surface and a second largest planar surface; forming a backmetal layer on the second largest planar surface; attaching a tape over the backmetal layer; and electroless depositing a metal layer on a pad included on the first largest planar surface. The method may include, after electroless depositing, removing the tape; and after removing the tape, baking the semiconductor substrate.