Electroless Plating Adhesion via Self-Assembled Monolayer
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Solution Overview
Problem
Existing electroless plating methods face challenges in achieving strong adhesion between metal precipitated in recesses of substrates and the surface partitioning the recess, leading to potential issues like stress migration and disconnection due to inadequate bonding during temperature changes.
Innovation Solution
A substrate liquid processing method involving the formation of a self-assembled monolayer on the recess walls, followed by attachment of an intermolecular binder that enhances bonding between the metal and the monolayer, and subsequent electroless plating to precipitate metal while maintaining close contact with the binder, thereby improving adhesion and fixing properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electroless plating is performed to bury metal in recesses, then metal filling is achieved, but adhesion between the metal and the partitioning surface is insufficient
Solution Approach 1:
A self-assembled monolayer is formed on the partitioning surface to act as an intermediary between the substrate and the metal. This monolayer provides specific chemical groups that enhance bonding interactions, ensuring strong adhesion between the metal precipitate and the substrate surface during electroless plating.
Solution Approach 2:
The surface chemistry of the partitioning surface is modified by forming a self-assembled monolayer with specific functional groups. This changes the chemical parameters of the surface to improve wettability and bonding affinity, thereby enhancing adhesion between the metal and substrate.
2Reliability
If metal is precipitated in recesses through electroless plating, then wiring formation is enabled, but stress migration and disconnection occur due to inadequate bonding
Solution Approach 1:
The self-assembled monolayer serves as a mediator that remains stable under temperature changes and provides continuous bonding between the metal and substrate. This intermediary layer prevents stress concentration and migration that would otherwise lead to disconnection.
Solution Approach 2:
A composite structure is formed consisting of the substrate, self-assembled monolayer, and metal precipitate. This multi-layer composite provides enhanced mechanical and thermal stability, resisting stress migration and disconnection under varying temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly enhances the adhesion and fixing properties between the metal and the substrate surface, reducing stress migration and disconnection risks, even under temperature changes, while allowing for the use of various metals and substrates.
Implementation Method 1
forming a self-assembled monolayer on a side wall of the recess
Implementation Method 2
attaching an intermolecular binder, which is allowed to be bonded to both a metal and the self-assembled monolayer, to the self-assembled monolayer
Implementation Method 3
burying, by supplying an electroless plating solution to the recess in a state where the intermolecular binder is attached to the self-assembled monolayer to precipitate the metal in the recess
Data Source
AI summary
A technique of improving an adhesion between a metal precipitated in a recess of a substrate and a surface partitioning the recess in an electroless plating processing in which a plated metal is deposited from the bottom of the recess is provided. A substrate liquid processing method includes preparing a substrate including a recess and a wiring exposed at a bottom of the recess; forming a self-assembled monolayer on a side wall of the recess; attaching an intermolecular binder, which is allowed to be bonded to both a metal and the self-assembled monolayer, to the self-assembled monolayer; and burying, by supplying an electroless plating solution to the recess in a state where the intermolecular binder is attached to the self-assembled monolayer to precipitate the metal in the recess, the metal in the recess while bringing the metal into close contact with the intermolecular binder.