Electroless Plating Apparatus Ultrasonic Vibration Uniformity
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Solution Overview
Problem
Conventional electroless plating techniques fail to achieve uniform thickness of plated films and effectively coat micro-size via holes or trenches on semiconductor wafers, which are critical for modern semiconductor technology.
Innovation Solution
An electroless plating apparatus with a container, wafer holder, electrolyte supplying unit, and ultrasonic-vibration unit is designed to ensure uniform electrolyte distribution and flow, using multiple inlets and ultrasonic transducers to facilitate even plating, especially for wafers with fine via holes or trenches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electroless plating technique is used, then the process is simple and well-developed, but the thickness uniformity of plated film is poor and micro-size via holes cannot be effectively plated
Solution Approach 1:
The container is divided into multiple compartments with separate inlet and outlet ports for each compartment. This segmentation allows independent electrolyte flow control for each wafer position, ensuring uniform electrolyte distribution and consistent plating thickness across all wafers while maintaining manageable system complexity through modular design
Solution Approach 2:
Each compartment is equipped with dedicated inlet and outlet ports positioned to create localized electrolyte circulation patterns. This local quality approach ensures that each wafer receives optimized electrolyte flow tailored to its specific position, achieving uniform plating thickness without requiring complete system redesign
Solution Approach 3:
The system employs hydraulic principles by using electrolyte flow through controlled inlet and outlet ports in each compartment. The electrolyte circulation creates pressure-driven flow patterns that ensure uniform distribution around each wafer, improving plating uniformity through fluid dynamics control
2Manufacturing precision
If conventional electroless plating technique is used, then the apparatus is simple, but the capability of plating micro-size via holes or trenches is insufficient
Solution Approach 1:
The container is divided into multiple compartments with separate inlet and outlet ports for each compartment. This segmentation allows independent electrolyte flow control for each wafer position, ensuring uniform electrolyte distribution and consistent plating thickness across all wafers while maintaining manageable system complexity through modular design
Solution Approach 2:
The system employs hydraulic principles by using electrolyte flow through controlled inlet and outlet ports in each compartment. The electrolyte circulation creates pressure-driven flow patterns that ensure uniform distribution around each wafer, improving plating uniformity through fluid dynamics control
3Manufacturing precision
If electrolyte is supplied through single inlet, then the apparatus is simple, but the electrolyte distribution is non-uniform
Solution Approach 1:
The container is divided into multiple compartments with separate inlet and outlet ports for each compartment. This segmentation allows independent electrolyte flow control for each wafer position, ensuring uniform electrolyte distribution and consistent plating thickness across all wafers while maintaining manageable system complexity through modular design
Solution Approach 2:
Each compartment is equipped with dedicated inlet and outlet ports positioned to create localized electrolyte circulation patterns. This local quality approach ensures that each wafer receives optimized electrolyte flow tailored to its specific position, achieving uniform plating thickness without requiring complete system redesign
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves uniform plating on semiconductor wafers, significantly improving the thickness of films on the inner sidewalls and bottom surfaces of via holes, ensuring high-quality plating suitable for semiconductor technology.
Implementation Method 1
The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container and is used for producing a uniform flow of electrolyte in the container
Implementation Method 2
Electroless plating technique has been a well-developed plating technology
Data Source
AI summary
An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is provided with at least an inlet and used for containing electrolyte. The wafer holder is provided within the container. The electrolyte supplying unit is used to supply the electrolyte into the container via the inlet. The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container for producing a uniform flow of electrolyte in the container. Thereby, the wafers can be uniformly plated, especially for wafers with fine via-holes or trench structures.