Electroluminescent Device Shunt Means and Protective Layer
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Solution Overview
Problem
The application of material deposition techniques for manufacturing electrical shunt means on the substrate electrode of electroluminescent devices is laborious and expensive, leading to inhomogeneous current distribution and luminance.
Innovation Solution
The use of a wire, metallic stripe, or foil as an electrical shunt means, fixed to the substrate electrode with a protective conductive glue, ensuring homogeneous current distribution by forming an electrical connection between the outer and inner areas of the substrate electrode, thereby preventing shadowing edges and improving luminance uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If material deposition techniques are used to manufacture electrical shunt means, then the shunt means can be integrated on the substrate electrode, but the manufacturing process becomes laborious and expensive
Solution Approach 1:
The patent applies screen printing technology to create electrical shunt means using conductive paste, which is a simpler and more cost-effective manufacturing approach compared to traditional material deposition techniques. This principle replaces complex, expensive manufacturing processes with simpler, more accessible ones while maintaining the functional integrity of the shunt means.
2Manufacturing precision
If electrical shunt means are applied on the substrate electrode, then current distribution improves, but shadowing edges may emerge on the substrate electrode
Solution Approach 1:
The patent employs a transparent encapsulation layer that fully covers the electrical shunt means, creating a smooth transition between the shunt means and the substrate electrode. This thin film approach prevents shadowing edges from forming while maintaining the current-distributing function of the shunt means, as the encapsulation layer is transparent and conformal.
3Ease of manufacture
If the electrical shunt means are not fully covered, then the manufacturing process is simpler, but the risk of shorts increases
Solution Approach 1:
The transparent encapsulation layer serves multiple functions simultaneously: it fully covers the electrical shunt means to prevent shorts, provides mechanical protection, maintains the smooth surface to prevent shadowing edges, and allows optical transmission. This multi-functional approach enhances reliability without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the homogeneity of current distribution and luminance across the electroluminescent device, reducing the risk of shorts and extending the device's lifespan by using a simpler, cost-effective manufacturing method.
Implementation Method 1
prevent the emergence of a shadowing edge on the substrate electrode
Implementation Method 2
forming an electrical connection between the outer and inner areas of the substrate electrode
Data Source
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AI summary
The invention relates to an electroluminescent device (10) comprising a substrate (40) and on top of the substrate (40) a substrate electrode (20), a counter electrode (30) and an electroluminescent layer stack with at least one organic electroluminescent layer (50) arranged between the substrate electrode (20) and the counter electrode (30), and at least one electrical shunt means (122) applied on top of the substrate electrode (20) to improve the current distribution over the substrate electrode (20), wherein the at least one electrical shunt means (122) is at least one element of the group of a wire, a metallic stripe or foil, said electrical shunt means (122) fixed to the substrate electrode (20) by a protective means (70) fully covering the electrical shunt means (122) with a shape suitable to prevent the emergence of a shadowing edge on the substrate electrode (20). The invention further relates to a method to manufacture such a device.