Flow-Controlled Electrolyte Distribution Body for Uniform High-Speed Plating
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Solution Overview
Problem
Existing high-speed plating systems face challenges in achieving uniform electrolyte and current distribution across large substrate panels, leading to non-uniform plating due to vertical and horizontal flow inconsistencies, which conventional baffle plates fail to adequately address.
Innovation Solution
A distribution body with a flow control array featuring specific arrangements of flow control elements upstream of the outlet array, promoting turbulent flow and optimizing Reynolds numbers to achieve uniform liquid distribution, both horizontally and vertically, without significantly reducing overall flow speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If baffle plates are installed to reduce non-uniform flow distribution, then horizontal flow uniformity is improved, but overall electrolyte flow speed is significantly reduced and vertical non-uniformity remains unsolved
Solution Approach 1:
The distribution body is segmented into multiple functional zones with different flow control characteristics. The first distribution zone has a first flow control characteristic while the second distribution zone has a second flow control characteristic, allowing independent optimization of flow uniformity and flow speed in different regions.
Solution Approach 2:
Different regions of the distribution body are given different local properties through varied flow control characteristics. The first and second distribution zones have different flow control characteristics tailored to their specific positions and functions, enabling localized optimization rather than uniform treatment throughout the entire system.
2Manufacturing precision
If baffle plates are used to restrain electrolyte flow in high flow-speed areas, then horizontal non-uniformity is mitigated, but vertical non-uniformity challenges remain unaddressed
Solution Approach 1:
The distribution body is divided into multiple distribution zones (first and second zones) with different flow control characteristics. This segmentation allows the system to independently address horizontal and vertical flow uniformity issues through zone-specific characteristics, making the system adaptable to multi-directional flow distribution challenges.
Solution Approach 2:
The first and second distribution zones are designed with different local flow control characteristics suited to their specific functional requirements. This local differentiation enables the system to handle both horizontal and vertical non-uniformity problems effectively, enhancing overall adaptability.
3Productivity
If HSP systems are scaled up to accommodate larger substrate panels, then processing capacity is improved, but horizontal and vertical flow and current distribution non-uniformity increases
Solution Approach 1:
The distribution body is segmented into multiple zones with different flow control characteristics. This segmentation allows the system to maintain uniform flow distribution even when scaled up for larger substrate panels, as each zone can be optimized independently to compensate for increased system size.
Solution Approach 2:
Different regions of the distribution body have tailored flow control characteristics that adapt to the specific requirements of large-scale processing. This local optimization ensures that even in scaled-up systems, uniform plating results are achieved across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures optimally uniform plating results by equilibrating flow distribution, reducing the required space and material costs, and enabling efficient processing of larger panels with improved uniformity and reduced size and weight.
Implementation Method 1
promoting turbulent flow and optimizing Reynolds numbers to achieve uniform liquid distribution
Implementation Method 2
optimizing Reynolds numbers to achieve uniform liquid distribution
Implementation Method 3
The arrangement of several flow control elements upstream of the outlet array allows equilibrating the flow of electrolyte towards the jet holes
Implementation Method 4
Uniform electroplating using HSP systems requires that a high uniform flow field over the complete active area of the panel can be established and controlled
Data Source
AI summary
The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of a distribution body or a distribution system for a chemical and/or electrolytic surface treatment of a substrate in a process fluid and a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate. The distribution body comprises: a front face, a rear face, at least an inlet, an outlet array, and a flow control array. The front face is configured to be directed towards the substrate for the surface treatment of the substrate. The rear face is arranged opposite to the front face. The inlet is configured for an entry of the process fluid into the distribution body. The outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate. The flow control array is arranged upstream of the outlet array with respect to a flow of the process fluid and comprises several flow control elements.