Electrolytic Bonding Diaphragm for Thin Speaker Design
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Solution Overview
Problem
Conventional moving coil type speakers have a large monomer thickness due to the use of back adhesives for fixing voice coils, limiting their suitability for small volume applications and hindering the increase of magnetic flux density without increasing overall thickness.
Innovation Solution
The diaphragm structure employs electrolytic bonding to fix metal coils on thin-films, allowing for a laminated configuration that reduces thickness and increases magnetic flux without increasing overall dimensions, using a thin-film layer with conductive structures and electrolytic bonding layers to connect circuit thin-film layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If back adhesive is used to fix voice coils onto thin-film, then the voice coils are securely fixed, but the monomer thickness increases
Solution Approach 1:
The patent removes the adhesive layer from the fixation process, replacing it with direct electrolytic bonding between metal coils and thin-film. This extraction of the adhesive component eliminates the thickness contribution of the adhesive layer while maintaining secure fixation through electrochemical bonding.
Solution Approach 2:
The patent replaces the mechanical adhesive bonding system with an electrolytic bonding system. Instead of using mechanical adhesion through adhesive materials, the invention uses electrochemical reactions to create direct metallurgical bonding between the metal coils and thin-film, achieving both strong fixation and reduced thickness.
2Power
If the number of coils is increased to improve magnetic flux density, then the sensitivity of the sounding apparatus is improved, but the monomer thickness becomes excessively large
Solution Approach 1:
The patent transitions from increasing magnetic flux density by adding more coils in the thickness direction to achieving enhanced magnetic flux through lateral expansion and optimized coil geometry. The electrolytic bonding enables thinner, more densely packed coil structures that increase effective magnetic flux without increasing the thickness dimension.
Solution Approach 2:
The invention changes the bonding method parameter from adhesive-based to electrolytic bonding, which fundamentally alters the thickness parameter. This parameter change enables the system to accommodate higher coil densities and improved magnetic flux configurations while maintaining reduced monomer thickness.
3Reliability
If conventional moving coil type speaker structure is used, then good sound quality at low and medium frequency is achieved, but the apparatus size and monomer thickness are too large for small volume applications
Solution Approach 1:
The patent segments the traditional moving coil speaker structure into thin-film diaphragm components with integrated electrolytically-bonded metal coil structures. This segmentation enables independent optimization of each component's thickness and geometry, achieving compact overall dimensions while preserving the acoustic performance characteristics of the moving coil principle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the diaphragm thickness from 8.75 μm to 4 μm, enabling smaller speaker dimensions and improved sensitivity by maintaining a reduced thickness while enhancing magnetic flux density.
Implementation Method 1
The first circuit thin-film layer is fixed to the first side of the thin-film layer by means of a first electrolytic bonding layer and the second circuit thin-film layer is fixed to the second side of the thin-film layer by means of a second electrolytic bonding layer
Implementation Method 2
The at least one conductive structure penetrates through the thin-film layer to connect the first circuit thin-film layer and the second circuit thin-film layer
Implementation Method 3
corresponding audio frequency current is passed through the enameled coil such that the magnetic field of the coil is changed by electromagnetic induction to drive the diaphragm to vibrate
Data Source
AI summary
The present invention provides a diaphragm structure of a sounding apparatus comprising: a thin-film layer; a first circuit thin-film layer fixed on a first side of the thin-film layer by means of a first electrolytic bonding layer; a second circuit thin-film layer fixed on a second side of the thin-film layer by means of a second electrolytic bonding layer; multiple holes passing through the first circuit thin-film layer, the thin-film layer and the second circuit thin-film layer; and multiple conductive layers disposed on inner circumferential walls of the holes and in contact with the first circuit thin-film layer and the second circuit thin-film layer. In the diaphragm structure provided by the present invention, instead of using back adhesives, electrolytic bonding is used to fix the circuit thin-film layers on two sides of a thin-film layer, thereby greatly reducing the thickness of the diaphragm structure.