Electrolytic Distribution System with Controllable Cathode Pixels
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Solution Overview
Problem
The challenge in electroplating is achieving uniform current density distribution across substrates with high-density small structures and low-density larger structures, exacerbated by the terminal effect caused by the high resistivity of seed-layers, leading to non-uniform plating thickness.
Innovation Solution
A distribution system comprising a primary cathode and a secondary cathode with individually controllable cathode pixels, arranged in an array to align with the substrate, allowing for localized control of current density distribution, particularly down to the sub-μm range, to mitigate the terminal effect and ensure uniform plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a seed-layer is used to distribute current across the substrate surface, then current distribution is enabled, but potential drop occurs due to high resistivity leading to non-uniform plating thickness
Solution Approach 1:
The cathode is segmented into multiple independently controllable cathode pixels arranged in an array, allowing localized current control across different substrate regions to compensate for potential drops and achieve uniform plating thickness
Solution Approach 2:
Different cathode pixels can be controlled with different potentials based on local requirements, enabling tailored current density distribution in different areas of the substrate to overcome the terminal effect and achieve uniform plating
2Manufacturing precision
If individually controllable cathode pixels are used to adjust current density distribution, then plating uniformity is improved, but device complexity increases
Solution Approach 1:
The cathode is divided into multiple pixels that can be independently controlled, providing fine-grained control over current density distribution while maintaining a modular and manageable structure
Solution Approach 2:
The cathode pixels can be dynamically controlled with different potentials based on real-time process requirements, enabling adaptive current distribution to achieve uniform plating across various substrate types and configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise adjustment and tuning of current density distribution across the substrate, improving plating uniformity and reducing the terminal effect, suitable for both non-rotating and rotating substrates, and enhancing the plating of high-performance devices.
Implementation Method 1
The primary cathode and the secondary cathode are arranged to attract the electric current and to guide the electric current to the substrate
Implementation Method 2
an electrolytic surface treatment of a substrate
Implementation Method 3
Electroplating, e.g. of copper, is a frequently used technology in many different industries
Data Source
AI summary
The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for an electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9). The disclosure further relates to a distribution module (14) and a distribution method (100).