Electrolytic Plated Terminations for Multilayer Ceramic Capacitors
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Solution Overview
Problem
Existing termination technologies for multilayer electronic components face challenges such as precision issues with shrinking component sizes, misalignment, shorting, and high costs due to the need for thick film termination stripes and complex manufacturing processes, which are difficult to control and apply effectively.
Innovation Solution
The development of plated termination features that eliminate or simplify thick-film stripes by using internal electrode elements and anchor tabs to facilitate secure and reliable external plating, allowing for self-determining formation of plated terminations without the need for specialized machinery, enabling finer pitch and lower inductance levels, and reducing susceptibility to solder leaching and insulation resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick film termination stripes are applied to multilayer electronic components, then electrical connections can be established, but manufacturing precision deteriorates due to misalignment and shorting issues
Solution Approach 1:
The patent removes the thick film termination stripe layer entirely and replaces it with plated terminations formed directly on exposed internal electrode tabs. This extraction eliminates the alignment and shorting problems associated with thick film stripes while maintaining electrical connection functionality through the plating process applied to precisely positioned electrode tabs.
Solution Approach 2:
The patent replaces the mechanical thick film stripe application process with an electrolytic plating process. Instead of mechanically applying and firing thick film material, the invention uses electrochemical deposition to form precise metal terminations on exposed electrode tabs, achieving superior precision and reliability.
2Productivity
If component sizes are reduced to increase integration density, then productivity improves, but manufacturing precision deteriorates due to resolution limits of termination machines
Solution Approach 1:
The patent replaces mechanical termination application with electrolytic plating, which is not constrained by the resolution limits of mechanical termination machines. The electrochemical process can deposit metal with much finer precision on smaller components, enabling continued miniaturization without sacrificing termination precision.
Solution Approach 2:
The patent changes the fundamental parameter of how terminations are formed - from mechanical deposition of thick film material to electrochemical deposition of metal. This parameter change enables precise control of termination dimensions at much smaller scales, supporting higher integration density without precision loss.
3Reliability
If multiple terminations are added to reduce inductance levels, then electrical performance improves, but device complexity increases due to additional manufacturing steps
Solution Approach 1:
The patent performs preliminary action by exposing internal electrode tabs during the component fabrication process itself, before the plating step. This integration of tab exposure into the base manufacturing process eliminates the need for separate, complex termination application equipment and steps, reducing overall device complexity while enabling multiple terminations for improved electrical performance.
Solution Approach 2:
The patent makes the internal electrode tabs serve dual functions: as electrical conductors within the component and as substrates for termination formation. This multi-functionality eliminates the need for separate termination structures and simplifies the manufacturing process while enabling multiple terminations for reduced inductance.
4Reliability
If thick film termination stripes are used, then electrical connections are established, but loss of substance occurs due to solder leaching and insulation resistance issues
Solution Approach 1:
The patent uses composite plating structures with multiple metal layers (such as nickel and gold, or copper and tin) deposited on the electrode tabs. These composite material structures provide superior corrosion and solder leaching resistance compared to single-layer thick film terminations, while maintaining electrical connection stability.
Solution Approach 2:
The patent employs sacrificial or protective plating layers that can be consumed or degraded preferentially to protect the underlying electrode structure from solder leaching. This approach uses relatively thin, cost-effective metal layers that serve as protective barriers against substance loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides reliable and cost-effective termination features with improved resolution, enabling more terminations in a smaller area, reduced equivalent series inductance (ESL), and enhanced mechanical and electrical properties, facilitating efficient production of electronic components with precise terminal shape and alignment.
Implementation Method 1
immersing the plurality of electronic components in an electrolytic plating solution with an electrical bias enables a plating material to be deposited at selected exposed conductive portions
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected of the exposed internal conductive elements. Electrolytic plating may be employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive material. Once an initial thin-film metal is directly plated to a component periphery, additional portions of different materials may be plated thereon.