Electromagnet Coil Stability via Low Mobility Members
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electromagnet manufacturing using thermoplastic resin insulating base materials experiences positional instability and short-circuiting due to thermocompression bonding, where the difference in layer numbers between conductors and base materials leads to uneven pressure distribution, causing movement and deformation.
Innovation Solution
Incorporating low mobility members made of the same material as the linear conductors, strategically placed around wound linear conductors to prevent movement during thermocompression bonding, ensuring positional stability and simplifying the manufacturing process by simultaneous formation with conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermocompression bonding is performed to manufacture the electromagnet, then the insulating base materials are bonded together to form a stacked body, but the thermoplastic resin moves due to pressure differences, causing positional instability and short-circuiting of linear conductors
Solution Approach 1:
The patent applies different mobility characteristics to different regions of the insulating base material by introducing low mobility members at specific locations (surrounded by linear conductors). This creates local quality differences where certain regions have restricted movement while others maintain thermoplastic mobility for bonding, thereby preventing conductor displacement in critical areas while preserving overall manufacturability
Solution Approach 2:
Low mobility members are introduced as intermediary elements between the linear conductors and the thermoplastic resin matrix. These intermediaries restrict the movement of surrounding resin during thermocompression bonding, thereby preventing the resin from shifting and causing conductor displacement or short-circuiting, while allowing the bonding process to proceed in non-restricted regions
2Device complexity
If the number of layers in the region with linear conductors is increased, then the coil structure is formed, but the pressure distribution becomes uneven during thermocompression bonding, causing greater movement of insulating base material
Solution Approach 1:
The patent creates local quality differences in the stacked body by placing low mobility members specifically in regions surrounded by linear conductors. This local modification counteracts the uneven pressure distribution caused by the multi-layer coil structure, restricting resin movement in high-risk areas while maintaining the necessary layer complexity for coil formation
Solution Approach 2:
Low mobility members are positioned in advance in regions that will experience excessive pressure during thermocompression bonding. This preliminary anti-action prevents the insulating base material from moving in response to the pressure differential, thereby maintaining the positional stability of linear conductors even in the complex multi-layer coil structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the shape of the electromagnet coil, prevents short-circuiting, and maintains reliable performance even with densely arranged conductors, while minimizing electromagnetic wave shielding effects.
Implementation Method 1
a plurality of insulating base materials 201 to 204 made of thermoplastic resin are stacked and thermocompression-bonded
Data Source
AI summary
An electromagnet includes a stacked body formed by stacking and thermocompression-bonding a plurality of insulating base materials having thermoplasticity and including wound linear conductors which define a spiral coil. In a region of each of the insulating base materials surrounded by each of the wound linear conductors, each of low mobility members is formed of a material having mobility lower than that of the insulating base materials at a temperature upon thermocompression-bonding of the insulating base materials.