Electromagnetic Mask Chuck for OLED Substrate Positioning
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Solution Overview
Problem
Conventional mechanical chucking methods for substrates and masks in processing systems often result in substrate damage due to high mechanical force, and electrostatic chucking of masks is challenging to implement effectively.
Innovation Solution
An electromagnetic mask chuck system using a series of electromagnets integrated into a substrate carrier or process chamber to securely position and chuck masks independently of substrates, minimizing contact force and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical force is used to hold the substrate and mask in place, then the substrate and mask can be securely positioned during processing, but high mechanical force causes substrate damage and contact contamination
Solution Approach 1:
The patent replaces the conventional mechanical chucking system with an electromagnetic chucking system. Electromagnets are used to generate magnetic fields that hold the substrate and mask in place without mechanical contact, thereby eliminating mechanical damage and contact contamination while maintaining secure positioning during processing
Solution Approach 2:
The patent introduces an electromagnetic field as an intermediary between the chucking system and the substrate/mask. The electromagnetic field acts as a non-contact mediator that applies holding force without physical contact, resolving the contradiction between secure positioning and avoidance of mechanical damage
2Object-affected harmful factors
If electrostatic force is used to hold the substrate in place, then contact between metal components and substrate is minimized, but electrostatic chucking of masks is challenging to implement effectively
Solution Approach 1:
The patent replaces the difficult-to-implement electrostatic mask chucking system with an electromagnetic chucking system. Electromagnets provide reliable and controllable magnetic fields that can effectively hold masks in place, overcoming the implementation challenges of electrostatic chucking while maintaining minimal contact benefits
Solution Approach 2:
The patent changes the physical parameter used for mask chucking from electrostatic force to electromagnetic force. This parameter change enables more effective and controllable mask positioning, as electromagnetic fields can be more readily generated and controlled for mask-sized objects compared to electrostatic fields
3Reliability
If mechanical force is concentrated at the edges of the substrate to ensure sufficient clamping force, then the substrate can be securely held, but contact contamination and physical damage occur at the edges
Solution Approach 1:
The patent replaces the edge-concentrated mechanical clamping system with a distributed electromagnetic field system. The electromagnetic field can be distributed across the entire substrate and mask surfaces, providing uniform holding force without concentrating stress or contact at the edges, thereby eliminating edge contamination and damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electromagnetic mask chuck system allows for controlled and secure positioning of masks during processing, reducing the risk of substrate damage and enabling precise deposition of organic materials, such as in OLED manufacturing, while maintaining substrate stability.
Implementation Method 1
By incorporating a series of electromagnets, a mask and a substrate can be chucked to the substrate carrier in a controlled fashion
Implementation Method 2
a mask is electromagnetically chucked to the substrate disposed on the substrate carrier
Data Source
AI summary
An electromagnetic mask chuck is described herein. The electromagnetic mask chuck includes a body with a plurality of electromagnets formed therein. The electromagnets can then deliver a magnetic force to a mask to position and hold the mask over or on the substrate for further deposition. The electromagnets are controlled using a power source, to deliver a controlled magnetic field to the mask.