Electromagnetic Induction Panel Layering for Folding Damage Resistance
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Solution Overview
Problem
Electronic devices with flexible displays, such as foldable devices, face challenges in protecting electromagnetic induction panels from damage during folding and unfolding, particularly due to stress and strain on the conductive layers.
Innovation Solution
The electronic device incorporates a hinge structure that allows the housings to transition between folded and unfolded states, with an electromagnetic induction panel featuring a deformable folding region and planar region, including insulating and conductive layers, where the second conductive layer in the folding region is thicker than the first layer, providing enhanced protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the electromagnetic induction panel uses thin conductive layers for flexibility, then the device can be folded, but the conductive layers are prone to damage from stress and strain during folding
Solution Approach 1:
The patent applies different thicknesses of conductive layers at different locations. Specifically, the first conductive layer has a first thickness in a first region and a second thickness in a second region, where the first and second thicknesses are different. This local variation in thickness provides enhanced stress distribution and damage resistance in critical folding regions while maintaining flexibility overall.
Solution Approach 2:
The electromagnetic induction panel uses composite structures combining multiple conductive layers (first and second conductive layers with different thicknesses) and insulating layers. This composite material approach allows the panel to achieve both flexibility for folding and sufficient strength to resist damage during folding operations.
2Reliability
If the conductive layers are made thicker to reduce damage, then damage resistance improves, but the panel loses flexibility and cannot be folded
Solution Approach 1:
Instead of uniformly increasing thickness, the patent applies thicker conductive layers only in specific regions where stress concentration occurs during folding. The first conductive layer has different thicknesses in different regions, providing localized reinforcement exactly where needed while keeping other regions thin and flexible.
Solution Approach 2:
The conductive layer is segmented into multiple layers with different thicknesses rather than using a single uniform layer. This segmentation allows different portions of the panel to have different mechanical properties, with thicker sections providing strength and thinner sections providing flexibility.
3Ease of manufacture
If uniform thickness is used for simplicity, then manufacturing is easier, but stress distribution during folding is uneven causing damage
Solution Approach 1:
The patent implements non-uniform thickness distribution in the conductive layers, with specific regions having different thicknesses to optimize stress distribution during folding. While this increases manufacturing complexity compared to uniform thickness, it significantly improves reliability by preventing stress concentration and layer damage in critical folding zones.
Data Source
AI summary
An electronic device may include: a first housing; a second housing; a hinge structure, including a hinge, rotatably connecting the first housing and the second housing; a display; and an electromagnetic induction panel disposed between at least the display and the hinge structure and including a first folding region, which can be deformed, by the hinge structure and a first flat region, which is connected to the first folding region and disposed between the display and the one surface of the first housing. The electromagnetic induction panel may further include: an insulating layer; at least one first layer disposed above the insulating layer; and at least one second layer disposed below the insulating layer, wherein the thickness of the at least one second layer in the first folding region is greater than the thickness of the at least one first layer in the first folding region.