Electromigration Testing via Segmented Copper Bump Joints
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Solution Overview
Problem
Current methods for electromigration testing in microelectronics, such as daisy chain testing and V-groove testing, are costly, inefficient, and unable to accurately measure real-time temperature and resistance fluctuations at individual interconnects, making it difficult to understand and quantify electromigration effectively, especially in small-scale microelectronics systems.
Innovation Solution
A method and system for testing electromigration using copper pins with 30-50 micron bumps, forming a joint with solder, and applying current to evaluate electromigration, which includes precise alignment and characterization using cameras and a moveable platform to replicate the size and conditions of microelectronics systems, allowing for cost-effective and efficient testing of individual joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If daisy chain testing or V-groove testing is used for electromigration testing, then testing can be performed, but the testing cost increases and efficiency decreases
Solution Approach 1:
The invention segments the testing approach by using individual separate joints instead of interconnected daisy chains or V-groove structures. Each joint can be tested independently, allowing parallel testing of multiple joints simultaneously, which dramatically improves testing efficiency and reduces costs while maintaining reliable electromigration measurement capability
Solution Approach 2:
The invention uses simplified joint structures that replicate the essential electromigration characteristics of real microelectronics interconnects without requiring complex fabrication processes. The bumps and joints are created using standard spherical bump technology rather than specialized V-groove or daisy chain structures, making the testing more cost-effective and efficient
2Reliability
If daisy chain testing or V-groove testing is used for electromigration testing, then testing can be performed, but the testing cost increases
Solution Approach 1:
By using individual separate joints instead of interconnected structures, each joint can be manufactured and tested independently using standard spherical bump technology. This segmentation eliminates the need for complex daisy chain or V-groove fabrication processes, significantly reducing manufacturing costs while maintaining testing capability
Solution Approach 2:
The invention employs simple, easily manufacturable joint structures with standard spherical bumps that can be produced cost-effectively. These individual joints serve as disposable or reusable test specimens that eliminate the need for expensive specialized fixtures and complex interconnect structures
3Reliability
If conventional testing methods are used, then testing can be performed, but real-time temperature and resistance fluctuations at individual interconnects cannot be measured
Solution Approach 1:
By using individual separate joints instead of interconnected structures, each joint can be independently monitored with measurement equipment. This segmentation enables real-time measurement of temperature and resistance fluctuations at each specific joint, providing the measurement precision needed to accurately characterize electromigration while maintaining reliable testing capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate, efficient, and cost-effective electromigration testing of small-scale interconnects, providing real-time data on temperature and resistance, reducing setup time, and enabling parallel testing, thus improving understanding and reliability of microelectronics systems.
Implementation Method 1
a moveable platform for receiving the second cartridge and moving the first bump and the second bump into contact with one another
Implementation Method 2
a plurality of cameras for viewing alignment of the first bump and the second bump via operation of the moveable platform
Implementation Method 3
forming a joint between the first bump and the second bump with solder
Implementation Method 4
applying current to the joint to evaluate electromigration in the joint
Data Source
AI summary
Exemplary systems and methods allow for precise formation and subsequent characterization of electrical interconnects, for example solder joints associated with integrated circuit packages. The system may utilize a cartridge-like structure for use in aligning the metal components to be interconnected, and to facilitate subsequent testing of the interconnect.