Electron Beam 3D Metrology with Variable Landing Angles
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Solution Overview
Problem
Current metrology tools face challenges in accurately and efficiently performing 3D measurements on high aspect ratio semiconductor structures due to limitations in changing landing angles, leading to time-consuming and error-prone processes.
Innovation Solution
A method that utilizes varying electron beam landing angles within a single job run to capture multiple images of semiconductor structures at different angles, enabling precise 3D parameter determination by comparing image sets captured at distinct landing angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional electron beam metrology tools change landing angle between separate measurement tests, then accurate 3D measurements can be obtained, but the process becomes time-consuming and error-prone
Solution Approach 1:
The patent combines multiple landing angle measurements into a single job run by utilizing the scan coil to deflect the electron beam across different landing angles without requiring physical reconfiguration. This merges what were previously separate measurement tests into one continuous process, eliminating the time loss associated with repeated setup changes while maintaining measurement accuracy through consistent beam conditions.
Solution Approach 2:
The patent introduces dynamic control of the electron beam landing angle through the scan coil, allowing the beam to be deflected to different angles during a single measurement sequence. This dynamic adjustment capability enables the system to capture images at multiple landing angles without fixed mechanical reconfiguration, thereby reducing measurement time while preserving the ability to obtain accurate 3D parameters.
2Measurement precision
If traditional electron beam tools require multiple setup changes to capture images at different landing angles, then complete 3D metrology can be achieved, but measurement consistency deteriorates
Solution Approach 1:
By merging multiple landing angle measurements into a single job run using the scan coil, the patent eliminates the variability introduced by repeated setup changes. The electron beam remains in a stable, consistent state throughout the measurement sequence, with only the scan coil deflection changing the landing angle dynamically. This ensures measurement consistency and reliability while still capturing the necessary images for accurate 3D parameter determination.
3Ease of operation
If fixed landing angle is used in single metrology test, then tool operation is simplified, but 3D measurement capability is limited
Solution Approach 1:
The patent enhances the operational simplicity of fixed-landing-angle tools by adding dynamic angle adjustment through the scan coil. The electron beam can be deflected to different landing angles during a single job run without requiring complex physical reconfiguration or multiple setup changes. This maintains the ease of operation while significantly improving the adaptability and versatility for capturing 3D structures at multiple angles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces measurement time and increases accuracy by eliminating the need for multiple setup changes, ensuring all relevant 3D parameters are captured efficiently and reliably in a single job run.
Implementation Method 1
directing an electron beam onto a surface of the structure
Data Source
AI summary
A method of performing 3D metrology on a structure includes directing an electron beam onto a surface of the structure, capturing a first set of images of the structure at a first landing angle, capturing a second set of images of the structure at a second landing angle, the second landing angle being different from the first landing angle, and determining, by comparing the first set of images to the second set of images, at least one 3D parameter of the structure. The first set of images at the first landing angle and the second set of images at the second landing angle are captured in a single run of the electron beam across the surface of the structure.