Electron Beam Calibration Using Multi-Focus Image Displacement
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Solution Overview
Problem
Current examination systems for semiconductor fabrication lack effective methods for calibrating electron beam examination tools, which is crucial for achieving high precision and uniformity in device feature formation.
Innovation Solution
A system comprising processing circuitries that obtain images of semiconductor specimens using an electron beam examination tool. The system determines data informative of displacement and uses a model of the device to adjust the electron beam's deflection, ensuring it meets calibration criteria by controlling deflection elements with electrical sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual calibration methods are used for electron beam examination tools, then calibration can be performed, but calibration time is excessive and accuracy is insufficient
Solution Approach 1:
The system performs automatic calibration by acquiring images at different focal positions, determining displacements, and calculating correction values without manual intervention. The examination tool calibrates itself through automated image processing and model-based calculations, eliminating the need for manual calibration operations while achieving high precision through multiple focal position measurements and displacement analysis.
2Reliability
If traditional calibration procedures are used, then calibration can be completed, but repeatability is poor
Solution Approach 1:
The system acquires images at multiple focal positions, determines displacements of elements between these images, and uses this feedback information to calculate correction values for deflection elements. This closed-loop feedback mechanism ensures high repeatability by consistently measuring actual displacements and applying corresponding corrections, making the calibration procedure robust and reliable across different examinations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables automatic calibration of examination tools, reducing calibration time, improving accuracy, and enhancing calibration repeatability, thereby supporting the high demands of ultra large-scale integration in semiconductor fabrication.
Implementation Method 1
an electron beam examination tool operative to transmit an electron beam towards the semiconductor specimen through at least part of a device of the electron beam examination tool
Implementation Method 2
the device comprises or is associated with deflection elements and at least one electrical source usable to control the deflection elements
Data Source
AI summary
There are provided systems and methods comprising obtaining a set of images of at least one element of a semiconductor specimen, wherein the set of images has been acquired by an electron beam examination tool operative to transmit an electron beam towards the semiconductor specimen through a device of the electron beam examination tool, wherein each given image of the set of images has been acquired by the electron beam examination tool with a different focal point of the electron beam than for acquisition of one or more other images of the set of images, determining data informative of a displacement of the at least one element in the set of images, and using the data and a model informative of electron beam deflection to determine data usable to move the electron beam to a required position of the electron beam in the device.