Electron Beam Exposure Error Detection via Mask-Integrated Sensor
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Solution Overview
Problem
Current electron beam exposure apparatuses for semiconductor integrated circuits are inefficient in detecting errors, such as position or size errors, which are costly and time-consuming, often requiring separate measurement processes.
Innovation Solution
An electron beam exposure apparatus with an error detection device comprising a sensor with first and second lines and a data processor to compare signals from these lines, determining error detection information based on signal differences, including beam size and position information, and counting errors, which can be attached to or separate from the mask.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate measurement processes are used to detect electron beam errors, then measurement accuracy can be achieved, but detection time and costs increase significantly
Solution Approach 1:
The patent combines the error detection function with the exposure process itself by integrating a sensor into the mask structure. The sensor detects electron beam errors (position, size, shape) during the exposure process, merging two previously separate operations (exposure and measurement) into one unified process, thereby eliminating the need for separate measurement steps and reducing detection time while maintaining accuracy
Solution Approach 2:
The system enables self-detection of errors during the exposure process. The sensor integrated into the mask allows the exposure apparatus to automatically monitor and detect electron beam errors in real-time without requiring external measurement equipment or separate inspection processes, making the system self-sufficient for error detection
2Loss of information
If separate measurement processes are used to detect electron beam errors, then comprehensive error data can be obtained, but manufacturing costs increase
Solution Approach 1:
The patent integrates the sensor directly into the mask structure, combining the exposure medium and detection device into a single component. This integration eliminates the need for separate measurement equipment and processes, reducing overall system complexity and manufacturing costs while maintaining comprehensive error detection capabilities for position, size, and shape errors
Solution Approach 2:
The integrated sensor serves multiple functions: it detects electron beam position errors, size errors, and shape errors during the exposure process. This multi-functional approach replaces multiple specialized measurement devices that would otherwise be needed, reducing the overall cost of the error detection system while maintaining comprehensive error monitoring
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time error detection during exposure, reducing detection time and costs by providing accurate beam position and size information and counting errors efficiently.
Implementation Method 1
a sensor including a first line and a second line, wherein the sensor is to receive the second electron beam radiated on the first and second lines and to detect a first signal from the first line and a second signal from the second line
Data Source
AI summary
An electron beam exposure apparatus includes an electron beam source, a stage, and an error detection device. The electron beam source radiates a first electron beam corresponding to first input data and a second electron beam corresponding to second input data. The stage includes a mask on which the first electron beam is radiated. The stage may be configured to move the mask. The error detection device detects an error of the second electron beam and outputs error detection information.