Electron Beam Focus Map for Stepped Substrates
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Solution Overview
Problem
Existing methods for creating master plates in semiconductor processes using electron beam drawing struggle to accurately determine beam focus values and draw patterns on substrates with surface profiles that include level differences and slopes, leading to reduced drawing accuracy.
Innovation Solution
A drawing method that acquires arrangement and height information of stepped portions on the substrate, calculates a focus map based on this data, and adjusts the electron beam focus value accordingly to ensure precise pattern drawing, regardless of the substrate's surface profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electron beam drawing is performed on substrate with stepped portions, then pattern drawing can be completed, but beam focus value cannot be appropriately determined leading to reduced drawing accuracy
Solution Approach 1:
The patent applies preliminary action by calculating a focus map before actual pattern drawing. The system pre-acquires surface profile data of the substrate, pre-calculates appropriate beam focus values for different regions based on the surface profile, and stores this focus map for reference during drawing. This allows the electron beam to be properly focused on stepped portions without increasing operational complexity during the actual drawing process.
Solution Approach 2:
The patent changes the beam focus value parameter dynamically based on the substrate's surface profile. By acquiring surface profile data and calculating region-specific focus values, the system adjusts the beam focus parameter to match different heights and slopes on the substrate, thereby maintaining drawing accuracy across varied surface topographies without requiring complex real-time adjustment mechanisms.
2Manufacturing precision
If beam focus value is adjusted for stepped portions, then drawing accuracy improves, but measurement and calculation complexity increases
Solution Approach 1:
The patent uses copying by creating a digital focus map that replicates the substrate's surface profile information. Instead of performing complex real-time measurements during drawing, the system creates a computational model (focus map) that copies the essential surface profile characteristics, allowing accurate focus adjustment through data processing rather than complex physical measurement during operation.
3Manufacturing precision
If focus map calculation is performed, then high-accuracy pattern drawing is achieved, but processing time increases
Solution Approach 1:
The focus map calculation is performed as a preliminary step before actual pattern drawing. By completing the computationally intensive focus map generation in advance, the system trades off pre-processing time for significantly improved drawing accuracy during the actual manufacturing process, where time is more critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-accuracy pattern drawing on substrates with varying surface profiles, improving the precision of semiconductor master plates and templates by compensating for sagging and stepped portions.
Implementation Method 1
drawing a pattern on a substrate with an electron beam
Data Source
AI summary
According to one embodiment, a drawing method includes acquiring a first arrangement information indicating an arrangement state of a stepped portion on a substrate. The method further includes acquiring a height information indicating a height of the stepped portion. The method further includes measuring a height of the substrate. The method further includes calculating a focus map indicating a distribution of beam focus values of an electron beam according to a drawing location on the substrate on a basis of the acquired first arrangement information and the height information, and the measured height of the substrate. The method further includes drawing a pattern on the substrate by an electron beam with a beam focus value determined on a basis of the calculated focus map.