Electron Beam 3D Micro/Nanostructure Construction Method
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for constructing 3D micro/nanostructures lack precise control over material structure and size, particularly at the nanoscale, and existing 3D printing technologies are not suitable for high-precision processing of semiconductor devices due to limitations in processing accuracy and material flexibility.
Innovation Solution
A method involving the use of an electron beam to activate and control surface atoms of a material source, combined with a grating positioning displacement platform and focusing/scanning graphical control program, to create 3D micro/nanostructures by moving the electron beam focus point-by-point according to a designed shape, overcoming surface energy constraints and achieving nanoscale accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If bottom-top methods are used to prepare nanomaterials, then preparation cost is reduced and preparation speed is increased, but manufacturing precision and control over material structure are insufficient
Solution Approach 1:
The patent replaces traditional mechanical 3D printing systems with an electron beam-based system. The electron beam acts as a precise energy tool to manipulate atoms and molecules, enabling atomic-level precision in constructing 3D micro/nanostructures while maintaining the additive manufacturing approach of layer-by-layer construction.
Solution Approach 2:
The patent utilizes the focal position of the electron beam as a controllable parameter, positioning it within 0-100 nm from the material source surface. By adjusting the focal distance and electron beam energy, the system achieves precise control over material deposition and structure formation, resolving the contradiction between speed and precision.
2Manufacturing precision
If top-bottom methods are used for structure processing, then manufacturing precision is improved, but device complexity and process steps increase
Solution Approach 1:
The patent combines multiple functions into a single electron beam system: heating, ablation, deposition, and positioning are all achieved through electron beam control. This merges the complexity of multiple separate processing steps into one integrated system, maintaining high precision while reducing overall process complexity.
Solution Approach 2:
The electron beam serves multiple purposes: it heats the material source, ablates excess material, deposits atoms onto the substrate, and positions the focal point precisely. This multi-functionality eliminates the need for separate tools and processes, reducing device complexity while maintaining nanoscale machining accuracy.
3Productivity
If conventional 3D printing is used, then construction speed is increased, but processing accuracy deteriorates to more than 100 microns
Solution Approach 1:
The patent replaces mechanical deposition mechanisms with electron beam-controlled atomic deposition. The electron beam's ability to focus to sub-100 nm spots enables nanoscale precision while maintaining the rapid layer-by-layer construction approach of 3D printing, achieving both speed and accuracy.
4Manufacturing precision
If laser direct writing is used to achieve 100/200 nm processing accuracy, then manufacturing precision is improved, but material selection is limited to organic photosensitive monomers
Solution Approach 1:
The patent changes the fundamental parameter from optical wavelength (laser) to electron wavelength (electron beam). This enables interaction with a broader range of materials including metals, metal oxides, and inorganic compounds that are not photosensitive, while maintaining sub-100 nm processing accuracy through electron beam focusing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables real-time construction of 3D micro/nanostructures with enhanced processing accuracy at the nanoscale, addressing the limitations of existing technologies and promoting the development of nanofabrication and 3D printing by allowing precise control over material formation.
Implementation Method 1
focusing an electron beam to ensure that a position of a focus of the electron beam is 0-100 nm away from a surface of the material source
Data Source
AI summary
A construction method for 3D micro/nanostructure, comprising: Step (1), fixing and vacuuming a material source on a substrate; Step (2), focusing an electron beam to ensure that a position of a focus is 0-100 nm away from a surface of material source, and an interface local domain including the focus of electron beam and surface atoms is formed; and Step (3), controlling the focus of electron beam to move point by point according to a shape of a designed 3D micro/nanostructure, and realizing the construction of 3D micro/nanostructure. This disclosure realizes real-time construction of 3D micro/nanostructure through the migration of atoms driven by uneven atomic density and electric potential difference in interface local domain. This disclosure promotes integrative development of nanotechnology and 3D printing and has good value of application and promotion.