Electron Beam Window Tile Non-Uniform Cross Section
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Solution Overview
Problem
Current window tile assemblies in electron beam processing systems have a consistent cross-sectional geometry, which limits electron throughput and efficiency.
Innovation Solution
The window tile assembly features a non-uniform cross-sectional geometry throughout its depth, with tapered features that reduce hindrance to electrons, allowing for improved electron flow and mechanical support of the thin foil.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a consistent cross-sectional geometry is used throughout the depth of the window tile, then the manufacturing is simpler and structural integrity is maintained, but electron throughput is limited and efficiency is reduced
Solution Approach 1:
The window tile features a non-uniform cross-sectional geometry where the cross-section varies along the depth of the tile. Specifically, the cross-sectional area is larger at the first surface (vacuum side) and gradually decreases toward the second surface (foil side), creating a tapered or graded structure. This local variation in geometry optimizes electron flow by providing more space for electrons at the entry point while reducing material in the path of electron travel, thereby increasing electron throughput without requiring complete redesign of the entire structure.
2Productivity
If a non-uniform cross-sectional geometry is used throughout the depth of the window tile, then electron throughput is increased and efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The invention applies parameter changes by systematically varying the cross-sectional dimensions of the window tile along its depth. The cross-sectional area is changed as a function of position, creating a gradient structure that transitions from a larger cross-section at the vacuum side to a smaller cross-section at the foil side. This controlled parameter variation optimizes electron throughput by reducing geometric hindrance to electron flow while maintaining manufacturability through predictable geometric progression.
3Use of energy by moving object
If conventional window tile assemblies are used, then structural support is provided, but electron flow is hindered and power consumption increases
Solution Approach 1:
The non-uniform cross-sectional geometry creates regions of varying electron flow resistance throughout the window tile depth. By having a larger cross-section at the entry point and progressively reducing it toward the foil, the design optimizes the distribution of electron flow paths, reducing congestion and energy loss in high-density regions while maintaining adequate structural support in critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electron throughput, reduces power consumption, minimizes heat absorption, and increases the lifespan of the foil, enabling the use of smaller and more cost-effective electron beam processing systems.
Implementation Method 1
a tungsten filament is heated to about 2400K, which is the thermionic emission temperature of tungsten, to create a cloud of electrons
Implementation Method 2
The thin foil functions as a barrier between the vacuum chamber and the processing zone
Data Source
AI summary
Window tiles for electron beam systems are provided. The window tiles can comprise a first surface and a second surface, and one or more features extending from the first surface to the second surface. The one or more features can have a non-uniform or tapered cross-section between the first surface and the second surface. The first surface can be configured to be exposed to vacuum conditions and can be configured to receive electrons accelerated from an electron beam generator. The second surface can be configured to allow electrons to pass through to a foil. The window tiles can improve electron beam processing systems for example by increasing electron throughput, lowering power consumption, reducing heat absorption to the foil, improving and increasing foil life, and potentially allowing for use of smaller and cheaper machines in electron beam processing.