Electron Beam X-Ray Workpiece Positioning and Thickness Control
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Solution Overview
Problem
Existing methods face challenges in precisely positioning workpieces, determining remaining material layer thickness, and ending material removal at layer boundaries during machining, especially with non-transparent materials and electron beam processing.
Innovation Solution
Irradiating a workpiece with electron beams to generate X-rays, which are detected on the opposite side, allowing for precise measurement of surface structures, layer thickness, and control of material removal processes by analyzing X-ray intensity and spectrum changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If complex measurement methods are used to position workpieces with non-transparent materials, then positioning accuracy is improved, but device complexity and measurement time increase
Solution Approach 1:
The patent replaces complex mechanical measurement systems with an electron beam-based X-ray generation and detection system. The electron beam irradiates the workpiece to generate characteristic X-rays, which are detected on the opposite side to determine surface structures and positioning information, eliminating the need for complex external measurement devices.
Solution Approach 2:
The patent introduces X-ray radiation as an intermediary to penetrate non-transparent materials and reveal surface structures. The electron beam serves as the primary source, generating characteristic X-rays that act as mediators to carry information about the workpiece surface structures through the material to the detector.
2Productivity
If material removal is performed without real-time thickness monitoring, then processing speed is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent implements a feedback control system where the electron beam continuously irradiates the workpiece during material removal, generating characteristic X-rays that are detected in real-time. The detected X-ray intensity provides feedback about the remaining material thickness, allowing the system to automatically adjust or terminate the material removal process to achieve precise layer thickness control.
3Productivity
If high electron beam intensity is used for material removal, then productivity is improved, but measurement precision for remaining thickness deteriorates
Solution Approach 1:
The patent applies different electron beam intensities to different functional requirements: high intensity for material removal and low intensity for measurement. The system can switch between these modes or apply them spatially differentiated to achieve both high productivity and high measurement precision without mutual interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate positioning, real-time monitoring of material removal, and precise control of machining processes, including ending material removal at specific layer boundaries, enhancing the precision and efficiency of workpiece processing.
Implementation Method 1
the workpiece is irradiated on a first workpiece side with electron beams, which are selected in such a way that they generate X-rays in the material of the workpiece
Implementation Method 2
The material itself absorbs the X-rays again. Above a certain material thickness, however, the X-rays are no longer completely absorbed by the material
Data Source
Figure 1~3
AI summary
X-rays (8) are generated in a workpiece (3) by means of an electron beam (4), said x-rays emerging on the rear side (3b) of the workpiece in sufficiently thin areas of the workpiece (3) and being detected by means of an x-ray radiation sensor (5). The surface structure on both sides and the local material thickness can be determined by means of the x-ray intensity and the momentaneous irradiation of the electron beam (4). On the basis of such values, workpieces and/or workpiece machining devices can be adjusted, and the vertical material removal controlled in a material-removing workpiece-machining device.