Electron Cooling Loop for High-Heat Target Deformation Control

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Solution Overview

Problem

Targets subjected to intense heat experience deformation, leading to reduced efficiency and increased material costs, as existing cooling methods fail to prevent structural integrity loss and oxidation.

Innovation Solution

A method where a target emits electrons, which are transported to a heat sink, cooled, and then returned to the target, maintaining the target's temperature without deformation, using a system comprising particles, a heat sink, and a transporting medium.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling methods are used on targets subjected to intense heat, then cooling effect is achieved, but target deformation and structural integrity loss occur

Engineering Contradiction:
Improvetarget temperatureVSAvoidstructural integrity
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent replaces conventional mechanical cooling systems with a particle-based cooling approach. Particles are accelerated to high velocities and directed at the target, transferring kinetic energy to electrons in the target material. This electronic energy transfer cools the target without mechanical contact, avoiding the deformation and structural damage caused by traditional mechanical cooling methods.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the cooling mechanism from macroscopic thermal conduction to microscopic particle-electron energy transfer. By accelerating particles to specific velocities and controlling their interaction with target electrons, the system achieves cooling through controlled energy transfer at the electronic level, preventing the thermal stress and deformation associated with conventional cooling.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If conventional cooling methods are used on targets, then cooling effect is achieved, but oxidation and material degradation occur

Engineering Contradiction:
Improvetarget temperatureVSAvoidmaterial integrity
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent replaces contact-based cooling methods with a particle beam approach that transfers energy through electron interactions. Since the cooling particles do not physically contact or chemically interact with the target material, oxidation and material degradation are prevented while achieving effective cooling.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If expensive refractory materials are used to prevent target deformation, then structural integrity is maintained, but material costs increase

Engineering Contradiction:
Improvestructural integrityVSAvoidmaterial cost
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent applies cooling particles to the target before thermal damage or deformation can occur. By continuously or periodically applying the particle beam cooling, the target temperature is maintained below deformation thresholds, allowing the use of less expensive materials that would otherwise be unsuitable for high-temperature applications.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces the need for expensive refractory materials with a particle-based cooling system. Instead of relying on inherent material resistance to heat, the system actively manages target temperature through particle-electron energy transfer, enabling the use of cheaper, more easily manufactured materials.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Productivity

If particle beam current is increased to improve manufacturing speed, then productivity increases, but target temperature increases causing deformation

Engineering Contradiction:
Improvemanufacturing speedVSAvoidtarget temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent merges the particle beam used for material processing with a cooling particle beam. By directing cooling particles at the target simultaneously with or between processing operations, the system can maintain higher processing currents and speeds while actively managing target temperature to prevent deformation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent applies cooling particles to the target before excessive temperature buildup can occur during high-current processing. This preventive cooling approach allows the system to operate at higher productivity levels by continuously managing thermal accumulation before it reaches deformation thresholds.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides substantial cooling without deforming the target, increasing efficiency and reducing material costs by allowing the use of cheaper materials and enabling continuous operation without capacity limitations.

Implementation Method 1

cooling the electrons using the heat sink

Methodology Applied
Scientific EffectHeat sink: Heat Sink

Implementation Method 2

causing the target to emit electrons

Methodology Applied
Scientific EffectThermionic emission: Thermionic Emission

Data Source

PatentUS9933189B2Cooling a target using electrons
Publication Date: 2018.04.03 LOCKHEED MARTIN CORP
  • US9933189B2 patent drawing
  • US9933189B2 patent drawing
  • US9933189B2 patent drawing

AI summary

In an embodiment, a method includes, impinging a plurality of particles on a target such that electrons are emitted from the target and transporting the electrons from the target to a heat sink through a transporting medium. The target and the heat sink may be separated by a distance. The method further includes cooling the electrons using the heat sink and returning the electrons from the heat sink to the target.